Süss MicroTec AG to Sell Device Bonder Business

Süss MicroTec AG to Sell Device Bonder Business

Süss MicroTec AG / Disposal

Release of an Ad hoc announcement according to § 15 WpHG, transmitted by
DGAP - a company of EquityStory AG.
The issuer is solely responsible for the content of this announcement.

Munich, July 2007 – SUSS MicroTec AG (ISIN DE0007226706) has parted with
its Device Bonder business segment. SUSS MicroTec S.A.S., a wholly owned
subsidiary of the Group holding that is domiciled in St. Jeoire, France,
today agreed with the management of SMT S.A.S. on the sale of the Device
Bonder business in an MBO to S.E.T. S.A.S., a company owned by the former
management of SMT S.A.S. The purchase contract is to be signed and executed
on July 16, 2007.

Under the asset deal agreed, all assets and liabilities of SMT S.A.S.’s
Device Bonder business will be sold. Transfer of the Device Bonder business
was effected for financial purposes on January 1, 2007. The purchase price
is EUR 2 million, approximately the difference between the assets
transferred and the liabilities taken over by S.E.T. S.A.S. No substantial
effect on planned Group sales in the financial year 2007 is anticipated,
since SMT S.A.S. will execute all customer orders received by July 16, 2007
for the account of S.E.T. S.A.S.

This sale accords with the Group strategy announced in the Annual Report
for 2006 of concentrating on a few core businesses. There were few synergy
effects with other segments of the Group. Moreover, a relevant volume of
sales could only have been achieved in combination with other products that
do not form part of the SUSS Group portfolio.

Following the sale of the Device Bonder business’s assets, S.E.T. S.A.S.
and the SUSS Group will cooperate, among other things to look after
existing SUSS Group customers.  S.M.T. S.A.S. will continue as a sales
company for other SUSS products in France.

The Device Bonder, in contrast to a Wafer Bonder, handles electronic,
optical or MEMS (MicroElectroMechanicalSystems) components that have
already been separated from the wafer. These are then bonded with highest
precision either onto another wafer or onto other diced components before
the final packaging step.

For further information please contact: 

SUSS MicroTec AG, Investor Relations, Dr. Guenter Kast

Tel.: +49 89 320 07-454, Fax: +49 89 320 07-336, E-mail:

Dr. Guenter Kast
Head of Investor Relations and Corportate Communications
Tel.: +49 (0)89 32007-454, email: guenter.kast@suss.com

DGAP 13.07.2007 
Language:     English
Issuer:       Süss MicroTec AG
              Schleissheimer Strasse 90
              85748 Garching b. München Deutschland
Phone:        +49 (0)89 32007-454
Fax:          +49 (0)89 32007-450
E-mail:       ir@suss.de
Internet:     www.suss.de
ISIN:         DE0007226706
WKN:          722670
Listed:       Geregelter Markt in Frankfurt (Prime Standard); Freiverkehr
              in Berlin, Düsseldorf, Hamburg, München, Stuttgart
End of News                                     DGAP News-Service