Süss MicroTec AG: Shareholder's Meeting in Munich

Süss MicroTec AG: Shareholder's Meeting in Munich

Süss MicroTec AG / AGM/EGM

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Press Release 

SUSS MicroTec AG: Shareholder's Meeting in Munich 

Munich, Germany, June 25, 2009 - At the ordinary shareholder's meeting of
SUSS MicroTec AG (ISIN: DE0007226706), which took place yesterday in
Munich, Germany, 37.7 % of the equity capital was represented.
Approximately 120 shareholders, shareholder and bank representatives and
guests came to the Haus der Bayerischen Wirtschaft in Munich at the
Company's invitation.

The Chief Executive Officer, Frank Averdung, explained the results of the
previous fiscal year and the first quarter of 2009 in his statement of
accounts. The extraordinary charges totaling EUR 18.3 million, which were
the main factor burdening net income for the year, were emphasized, as were
the restructuring and cost-cutting measures that had been implemented as
early as the middle of the year. In addition, the Management Board detailed
the Company's orientation in terms of product strategy for the years to

Averdung stressed in particular, for instance, the future potential and
opportunities in the field of 3-D integration, a market of the future in
the field of wafer-level packaging. 'With 3M as a strategic cooperation
partner in the area of temporary wafer bonding, we are paired with a
renowned and innovative development partner,' Averdung told the
shareholder's meeting in Munich. 3M's Wafer Support System (WSS) supports
the thinning and processing of ultra-thin wafers during the 3-D packaging
process by using techniques and materials for temporary wafer bonding. The
SUSS MicroTec Bonders are designed to process 3M's WSS materials such as
UV-baking liquid adhesive or resist for light-activated separation layers.
As a result, SUSS MicroTec has advanced to the position of authorized
supplier for the 3M Wafer Support System and will manufacture and sell
XBC300 and CBC300 Wafer Bonders configured in-house. 'With our cooperation
partners 3M and Thin Materials we now have two top-class process solutions
in the area of temporary wafer bonding at our disposal, which will allow us
to produce flexible, modular bonder platforms in the future that can be
customized to our customers' requirements,' Averdung continued.

Agenda items included, in addition to the discharge of the Management Board
and Supervisory Board and the appointment of external auditors for the
individual and consolidated financial statements, the creation of new
contingent capital as well as the election of a new member of the
Supervisory Board.

Except the creation of new contingent capital and the authorization of the
Management Board to issue convertible or warrant-linked bonds the
shareholder's meeting voted by a large majority in favor of the resolutions
drafted by the Supervisory Board and Management Board of SUSS MicroTec AG.
However, counter-motions submitted from the shareholder side were rejected
by a majority of votes.

The Management Board and Supervisory Board were thus discharged for the
2008 fiscal year by a large majority of the vote. Sebastian Reppegather was
elected as successor for Dr. Franz Richter, whose tenure started on June
19, 2008. He will serve for the remainder of the original tenure. Mr.
Reppegather is a managing director of IED Beteiligungs-GmbH, Frankfurt am
Main, Germany, as well as Director of Investment at Fidinam S.A., Lugano,
Switzerland. Furthermore Mr. Reppegather is a member of the Supervisory
Board of Sterling Strategic Value Limited, Tortola, British Virgin Islands.
In a constitutive session that took place immediately after the
shareholders' meeting, the Supervisory Board elected the Board member Dr.
Stefan Reineck as the new Chairman of the Supervisory Board.

SUSS MicroTec AG (ISIN DE 0007226706)

About SUSS MicroTec

SUSS MicroTec is a leading supplier of process and test solutions for
markets such as 3-D Integration, Advanced Packaging, MEMS, Nanotechnology
and Compound Semiconductor. High-quality solutions enable customers to
increase process performance while reducing cost of ownership. SUSS
MicroTec supports more than 8,000 installed mask aligners, coaters, bonders
and probe systems with a global infrastructure for applications and
service. SUSS MicroTec is headquartered in Garching near Munich, Germany.
For more information, please visit http://www.suss.com.


This press release contains forward-looking statements relating to the
business, financial performance and earnings of SUSS MicroTec AG and its
subsidiaries and associates. Forward-looking statements are based on
current plans, estimates, projections and expectations and are therefore
subject to risks and uncertainties, most of which are difficult to estimate
and which in general are beyond the control of SUSS MicroTec AG.
Consequently, actual developments as well as actual earnings and
performance may differ materially from those which explicitly or implicitly
assumed in the forward-looking statements. SUSS MicroTec AG does not intend
or accept any obligation to publish updates of these forward-looking

SÜSS MicroTec AG
Julia Hartmann
Investor Relations / PR
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007 336 
Email: julia.hartmann@suss.com

25.06.2009  Financial News transmitted by DGAP
Language:     English
Issuer:       Süss MicroTec AG
              Schleissheimer Strasse 90
              85748 Garching b. München
Phone:        +49 (0)89 32007-161
Fax:          +49 (0)89 32007-336
E-mail:       ir@suss.com
Internet:     www.suss.com
ISIN:         DE0007226706
WKN:          722670
Listed:       Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr
              in Berlin, Düsseldorf, Hamburg, München, Stuttgart
End of News                                     DGAP News-Service