Be on alert for fraudulent orders!
SUSS MicroTec launches ACS200 Gen3: The new Generation 200 mm Automated Coater / Developer Platform
Garching, July 9, 2012 - SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, launches the third generation of the ACS200 Coating and Developing Platform. This newly developed tool offers an excellent mix of innovation and production proven technology components of the well-established ACS200Plus and Gamma platforms. The ACS200 Gen3 offers the capability to combine four wet process modules with up to 19 plates for high volume production.
The configuration flexibility of modules and technologies meets not only the requirements of the Advanced Packaging, MEMS and LED markets, it also bridges the gap between research & development and high volume manufacturing. Especially the newly designed coater module offers state of the art open bowl spin coating as well as the patented GYRSET(R) closed cover coating technology.
'The ACS200 Gen3 combines innovative design and production proven functionality with the modularity of our ACS200Plus and the compactness of our Gamma platform', says Frank P. Averdung, President and CEO of SUSS MicroTec. 'With this new generation we can offer our customers an outstanding coater / developer platform designed for precision and high yield production while focusing on low cost of ownership.'
About SUSS MicroTec
End of Media Release
Issuer: SÜSS MicroTec AG
Key word(s): Products/Innovation
09.07.2012 Dissemination of a Press Release, transmitted by DGAP - a company of EquityStory AG.
The issuer is solely responsible for the content of this announcement.
DGAP's Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases.
Media archive at www.dgap-medientreff.de and www.dgap.de
|Company:||SÜSS MicroTec AG|
|Schleissheimer Strasse 90|
|Phone:||+49 (0)89 32007-161|
|Fax:||+49 (0)89 32007-451|
|Listed:||Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr in Berlin, Düsseldorf, Hamburg, München, Stuttgart|
|End of News||DGAP-Media|