Publication of the Final Figures for the Fiscal Year 2013

Publication of the Final Figures for the Fiscal Year 2013



(DGAP-Media / 28.03.2014 / 07:11)

PRESS RELEASE

Publication of the Final Figures for the Fiscal Year 2013

- Full year sales with EUR 134.5 million at upper end of guidance

- Full year EBIT better than expected: EUR minus 19.4 million

- Sales of EUR 40.5 million in Q4

- Order Intake of EUR 29.1 million in Q4

- Strong Free Cash Flow in Q4 reaches EUR 14.0 million

Garching, March 28, 2014 - SUSS MicroTec AG, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, published its consolidated financial statements for the 2013 fiscal year today.

While the semiconductor industry posted record sales in 2013 the semiconductor equipment market contracted a second consecutive year. The challenging market environment is reflected in the business development and the key financial indicators of SUSS MicroTec. Order entry decreased by 14.1 % year-on-year to EUR 135,0 million (previous year: EUR 157.2 million). Sales of EUR 134.5 million were achieved, falling short of the previous year's level of EUR 163.8 million by 17.9 %. Thus order backlog stood at EUR 85.7 million at December 31, 2013 (December 31, 2012: EUR 86.5 million).

The gross margin declined from 35.0 % to 16.2 % in 2013. The reasons are a less favorable product mix between 200 mm and 300 mm tools in the Lithography segment as well as the low margin contribution of SUSS MicroTec Photonic Systems (Tamarack Scientific). In the Substrate Bonder segment the Company has restructured the product line permanent bonding: In the future the Company will cease selling permanent bond cluster systems, which have been loss making over the last years.

The group's core division - Lithography - posted a 22 % decrease in sales to EUR 88.3 million during the year under review (previous year: EUR 113.2 million). The Substrate Bonder division decreased its revenues from EUR 23.1 million to EUR 22.8 million, which is a decline of 1.3 %. The Photomask Equipment division contributed sales of EUR 18.4 million (previous year: EUR 22.9 million).

Earnings before interest and tax (EBIT) came in at EUR minus 19.4 million (previous year: EUR 11.7 million), which translates into an EBIT-margin of minus 14.4 %. The EBIT for 2013 includes a one off effect of EUR minus 13.2 million for the measures taken in the Substrate Bonder Division. The adjusted EBIT amounts to EUR minus 6.2 million.

Earnings after taxes (EAT) for continuing operations amounted to EUR minus 16.0 million, compared to EUR 7.6 million in the previous year. Earnings after taxes for the continuing and discontinued operations amounted to EUR minus 16.0 million (prior year: EUR 9.1 million). The EAT for 2012 includes a tax free gain of EUR 1.5 million resulting from the sale of the Test Business in 2010. The basic earnings per share (EPS) for the continuing operations totaled EUR minus 0.84 (previous year: EUR 0.40).


The Free Cash Flow for the fiscal year, before security transactions and extraordinary effects as well as M&A transactions, was EUR 4.1 million, compared to EUR minus 4.5 million in the previous year. Cash and interest bearing securities amounted to EUR 47.1 million at the end of the fiscal year 2013. Net liquidity increased from EUR 32.3 million to EUR 35.7 million on December 31, 2013 despite the acquisition of the real estate in Garching.

Outlook

Taking the order backlog at the yearend 2013 and the expected order entry for the first half of 2014 into account, the Company guides sales for the fiscal year to come in between EUR 135 million and 145 million. The operating result (EBIT) is expected to come in between EUR minus 5 and 0 million.

For the first quarter 2014 the management board expects an order intake between EUR 25 and 35 million.

About SUSS MicroTec
SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit http://www.suss.com

Disclaimer:
This press release contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its subsidiaries and associates. Forward-looking statements are based on current plans, estimates, projections and expectations and are therefore subject to risks and uncertainties, most of which are difficult to estimate and which in general are beyond the control of SUSS MicroTec AG. Consequently, actual developments as well as actual earnings and performance may differ materially from those which explicitly or implicitly assumed in the forward-looking statements. SUSS MicroTec AG does not intend or accept any obligation to publish updates of these forward-looking statements




Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: franka.schielke@suss.com


End of Media Release


Issuer: SÜSS MicroTec AG
Key word(s): Finance

28.03.2014 Dissemination of a Press Release, transmitted by DGAP - a company of EQS Group AG.
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260194  28.03.2014