SUSS MicroTec Delivers Enhanced Coater/Developer-System for Fan-Out Wafer-Level Packaging Applications

SUSS MicroTec Delivers Enhanced Coater/Developer-System for Fan-Out Wafer-Level Packaging Applications



(DGAP-Media / 14.05.2014 / 09:22)

PRESS RELEASE

SUSS MicroTec Delivers Enhanced Coater/Developer-System for Fan-Out Wafer-Level Packaging Applications

Garching, May 14, 2014 - SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has recently delivered a newly developed coater/developer tool to an Asian packaging foundry (OSAT). The system is based on SUSS MicroTec's industry proven ACS300-technology.The ACS300 tool is a modular cluster system designed to meet manufacturers' needs for clean, reliable and high throughput photolithography applications.

The tool was especially developed to process wafers for Fan-Out Wafer-Level Packaging applications. With this coater/developer system artificially created wafers, which can be larger than 300 mm, can be processed. On embedding chips on an artificial wafer, a certain space has to be ensured between the individual dice, for instance to allow for Fan-Out redistribution layers (RDL). This enables the formation of nearly as many micro-bumps per microchip as wanted, regardless of the size of the single chip. It is an enhancement of the standard packaging solutions for highly integrated microchips.

"We have developed new solutions and processes for cost efficient and high throughput applications for Fan-Out Wafer-Level Packaging," says Frank P. Averdung, President and CEO of SUSS MicroTec. "Our tailor-made solutions allow customers to move beyond standard processes and applications to drive the technological development in the semiconductor industry further."

About SUSS MicroTec

SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit http://www.suss.com




Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: franka.schielke@suss.com


End of Media Release


Issuer: SÜSS MicroTec AG
Key word(s): Enterprise

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268314  14.05.2014