SUSS MicroTec Launches XB8 - a New Semi-Automated High-Force Wafer Bonder

SUSS MicroTec Launches XB8 - a New Semi-Automated High-Force Wafer Bonder



(DGAP-Media / 2015-09-17 / 08:00)

SUSS MicroTec Launches XB8 - a New Semi-Automated High-Force Wafer Bonder

Garching, September 17, 2015 - SUSS MicroTec, a global supplier of equipment and applications for the semiconductor industry and related markets, has launched the new bonding platform XB8 today.

The XB8 wafer bonder is designed for a wide range of bonding processes. It supports substrates with a wafer size of up to 200 mm. Key process parameters can be adjusted in a wide range, which makes the system ideal for advanced process development. In a production environment, the high level of automation and reliability of the XB8 ensure a high level of process stability.

Typical applications include advanced packaging, MEMS, 3D integration and LED manufacturing. The XB8 wafer bonder offers a broad parameter window and is therefore suitable for carrying out all bonding processes. Bond force up to 100kN is available with a temperature range of up to 550 C. Different substrate shapes and wafer sizes are processed in specifically adapted fixtures. A multi-bond fixture, for example, enables the maximum possible throughput increase by bonding up to eight wafers at once.

"In addition to the high precision and the repeatability of the bonding process from wafer to wafer, a uniform process result across the wafer is essential for achieving a high yield.", says Stefan Lutter, General Manager of the bonder product lines. "The independent new heaters guarantee an even temperature distribution and also ensure an optimal bonding force homogeneity within the entire temperature range. The innovative mechanical and thermal structure of the XB8 wafer bonder enables optimal bonding force and temperature distribution across the wafer, resulting in a high product quality and yield."

For more information visit: www.suss.com/XB8

About SUSS MicroTec
SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit http://www.suss.com




Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: franka.schielke@suss.com


End of Media Release


Issuer: SÜSS MicroTec AG
Key word(s): Research/Technology

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395081  2015-09-17