DGAP-News: SÜSS MicroTec AG / Key word(s): Product Launch
SUSS MicroTec Launches XBS200 - A New Automated Permanent Wafer Bonding System
Its versatility and modular design offer maximum process flexibility in all permanent bonding tasks. A novel aligned wafer transfer method eliminates the complexity of traditional systems and offers consistent process results with excellent system availability. The XBS200 platform provides low cost of ownership for high-volume production of MEMS, LED and 3D stacked devices.
Its new bond aligner uses SUSS MicroTec's proprietary Inter-Substrate Alignment (ISA) technology and delivers consistent submicron alignment. Automated calibration and overlay verification ensures optimum repeatability.
The bond chamber is based on the very successful stand-alone XB8 bonder. It offers a wide parameter window with temperatures of up to 550 C and bond forces of up to 100kN. Its innovative mechanical and thermal chamber design results in optimal bonding force and temperature distribution across the wafer and therefore ensures high yield.
"With the development of the new XBS200 platform, SUSS MicroTec enters the attractive market for automated permanent bonding systems. The XBS200 is based on our successful temporary bonding equipment platform and was designed according to the needs and demands of our customers", says Stefan Lutter, General Manager of the bonder product line. "The XBS200 offers high throughput along with a small footprint, high alignment accuracy and repeatability as well as excellent temperature and bond force uniformity for maximum yield."
For more information visit: www.suss.com
About SUSS MicroTec
SUSS MicroTec AG
Senior Manager Investor Relations
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
|Company:||SÜSS MicroTec AG|
|Schleissheimer Strasse 90|
|Phone:||+49 (0)89 32007-161|
|Fax:||+49 (0)89 32007-451|
|Listed:||Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange|
|End of News||DGAP News Service|