Excimer Laser Debonder for 2.5 and 3D Integration 

SUSS MicroTec has recently introduced an Excimer Laser based Debonding module (ELD300), which allows the stress free separation of a glass carrier wafer that was bonded to a device wafer by means of an adhesive layer in order to support the device wafer during thinning or backside processing steps. Temporary bonding of device wafers to a carrier is typically used for supporting the device wafer during various critical process steps such as thinning and backside processing in area of 3D integration, 2.5D interposers, MEMS or power devices