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Low-Temperature Hermetic Seal Bonding for Wafer-Level MEMS Packaging Using Submicron Gold Particles with Stencil Printing Patterning

Wafer-level hermetic packaging with electrical interconnection is necessary for the integration of MEMS and LSI devices, and low-temperature metal bonding such as AuIn, AuSn, Cu-Cu and Au-Au has been increasingly attractive. Among those bonding methods, Au-Au thermo-compression bonding is a promising candidate, which has advantages of no concern of surface oxidation and simple process control.