Excimer Laser Via-Drilling - Options to Further Capabilities of Next Generation Wafer Level Processing Devices

SUSS MicroTec Photonic Systems (SMTPS) has extended its Excimer laser ablation expertise, and knowledge gained from close relationships with key advanced semiconductor material manufacturers, to Advanced Packaging’s top cutting-edge companies and research insti- tutions (Figure 1). By doing so, SUSS MicroTec has opened new and innovative avenues for industry-leaders to develop more capable and reliable Next Gene- ration Wafer Level Processing (WLP) Devices. This article highlights SUSS’s Excimer Laser Via-Drilling technology and its role in shaping Next Generation WLP Devices.