Automated Platform for Wafers of up to 300mm
Automated Platform for Wafers up to 200mm
Manual Spray Coater for High Topographies
Resist Coat and Develop Platform
Laboratory Spin Coat and Develop Solution for Wafers up to 150 and 200mm
Hot Plate Designed for R&D, Laboratories and Small Scale Production
Flexible Solution for Aqueous Development and Cleaning
Flexible Solution for Solvent Development and Cleaning
Highly Automated Platform for 300mm and 200mm Wafers
Alignment and Exposure for a Multitude of Applications
Automated Platform for Wafers up to 100mm or 150mm
Semi-automated mask aligner for wafer sizes of up to 12"/300 mm
For Industrial Research and Operator-Assisted Production
Semi-Automated Platform for Wafers up to 8"/200mm
Manual Mask and Bond Aligner for Wafer Sizes up to 6"/150 mm
State-of-the art R&D Solution for Small Substrates and Pieces
High Performance Projection Scanner for 300 mm Wafers
For Rigid & Flexible Displays, Advanced Substrates and 450 mm Wafers
Excimer Laser Stepper ELP300 Gen2
Automated Platform for Wafer Sizes up to 200 mm
Automated Platform for Wafer Sizes up to 300 mm
Universal Temporary Wafer Bonder for High Volume Manufacturing
Manual Bond Aligner Wafer Sizes up to 8"/200 mm
High Precision Bond Aligner
Semi-Automated Excimer Laser Debonder
Semi-automated Tool for Permanent Wafer Bonding of Wafers up to 8"/200 mm
Universal High-Force Wafer Bonder
Next-Generation Lithography | Clean, Bake and Develop
Photomask Processing Plattform for Advanced Bake, Resist Strip & Clean and Develop
Manual Photomask Processing
High-Quality Micro-Optics
Pre-owned and Certified
Alignment Measurement for Double-sided Substrates