ACS300 Gen2 Coater & Developer
Production Spin Coat / Develop Cluster for Wafer Level Packaging
The ACS300 Gen2 is a modular cluster system designed to meet manufacturers' needs for clean, reliable, high-throughput and modular photolithography processing for 200 and 300mm wafers. Both wafer sizes can be processed parallel or sequential without any mechanical changeover. SUSS MicroTec ACS300 Gen2 systems can be equipped with process modules for HMDS vapor priming, spin coating, spray coating, aqueous or solvent based developing, baking and cooling. It masters thin and thick resist applications as well as photosensitive polymers like polyimide, PBO and Cyclotene (BCB).
SUSS MicroTec ACS300 Gen2 addresses all requirements for sophisticated resist processing and the 3D-Integration and Wafer Level Packaging technology in particular.
- Concurrent 200 and 300mm wafer processing without mechanical changeover
- High-speed, high precision six-axis robot and optical centering
- Excellent thick resist capabilities and best-in-class EBR performance
ACS300 Gen2 allows flexible production planning from R&D/pilot production to the volume production stage. A small footprint configuration comes with 2 load port modules directly attached to the basic frame which guarantees for optimum cost-of-ownership. With a separate EFEM the machine can be equipped with 4 load port modules. It is equipped a high-precision 6-axis robot and camera based centering. With the GYRSET feature highly uniform resist layers with thicknesses from below 1µm to over 100µm can be produced in the process bowl.
The ACS300 Gen2 can be interfaced with the MA300 Gen2 proximity mask aligner to form the integrated LithoPack300 cluster.