MA12 Mask Aligner

手動光罩對準機 - 適用產業相關研究、提升成本效益

MA12 是專為方型載具與 300 mm 以內晶圓的對準和曝光所設計。適用於產業研究與實際生產。藉由可靈活操作與控制製程的解決方案,本機台的設計主要聚焦於先進封裝應用 (包含 3D 晶圓級晶片尺寸封裝) 以及敏感材質組件藉由可靈活操作與控制製程的解決方案,本機台的設計主要聚焦於先進封裝應用 (包含 3D 晶圓級晶片尺寸封裝) 以及敏感組件 MEMS.的研發與生產。

亮点

製程控制性強

可靠的弧形晶圓與敏感材質處理

絕佳的曝光均勻度

SUSS MicroTec Mask Aligner MA12

因其先進的對準技術以及可隨製程環境調整的光學系統,MA12 提供了最新微影製程發展與導入時所需的靈活度。輔助操作系統與智能圖像化的使用者介面,再加上手動晶圓處理的優點,營造出高度的製程控制度和可靠度。

先進的光罩對準技術允許將研發的製程輕鬆套用至 SUSS MicroTec 的量產型對準機 MA300 Gen2。

在單使用在對準器件晶圓同一面的結構  (例如:重佈線製程、微凸塊或相類似的結構)的壓印技術方面,光罩的位置標記透過頂部調整對準晶圓上的位置標記。依基板的特性,使用晶圓上儲存的位置資料或透過 SUSS MicroTec DirectAlign™ 產出的兩個現場圖片來做調整。

特色與優點

  • 光罩對準器中精準度之最
  • 清晰和強大的圖像識別,即使對比不明顯

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

如 MEMS、晶圓級封裝以及 3D 整合技術的應用,例如:中介層板上進行垂直穿孔 (TSV) 需要對準晶圓正面結構並將之轉印至背面。這類的調整更常使用光學的背面調整技術。內建的照相機系統能偵測光罩結構及晶圓背面結構,並將之互相對準。由於放置晶圓後會遮住光罩目標,因此其位置必須預先確定並儲存下來。此微整個對準系統特殊之處。

特色與優點

  • 透過 SUSS 光罩對準機的高機械精度與穩定性達成無與倫比的精確度

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

提高對準精度

由於對準精度的高要求,使得自動對準系統的功能性標準顯著提升。SUSS MicroTecs DirectAlign® 直接對準機圖像識別軟體的附加功能,摒棄了將圖像儲存在圖像儲存系統中的處理方法,改為使用實際圖像。圖像識別是採用業界標準的 PatMax 並達成優異的成果。。因此使用 DirectAlign® 直接對準機正面對準 SUSS 光罩對準機可達成 0,5 µm 的精準度。

Available for:

Automated Mask Aligners

Semi-Automated Mask Aligners

Operator-assisted systems maintain a high degree of process control and reliability in combination with the advantages of manual wafer handling.

Available for:

Semi-Automated Mask Aligner

The mask aligner optionally offers an automatic filter exchange unit for up to four filters that are selected via process recipe. This removes the risk of operator errors and thus improves yield and effective throughput.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

先將需轉印圖像的光罩對準並置於非常接近晶圓的位置( 即所謂「近接式微影 - "Proximity Lithography"」)。曝光時光罩圖像的陰影部分就會轉印至晶圓上。光罩與晶元間的確切距離以及光線亮度會影響曝光結果的品質。

因其安裝便捷的特性,被視為是3µm以上微結構製程中最經濟的技術。若使用接觸式曝光,線寬解析度可達次微米等級。一般使用於晶圓級晶片尺寸封裝、覆晶封裝、凸塊、微機電系統(MEMS), LED 以及功率裝置。本系統不但適用於大量生產,亦適用於產業研發的領域。

SUSS MicroTec 的光罩對準機使用近接式微影技術。

特色與優點

  • 高解析度、低光折射
  • 使用微透鏡,低異常

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

The lower the exposure gap from mask to wafer, the higher the resolution. In soft contact mode the wafer is brought into contact with the mask and is fixed onto the chuck with vacuum.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

In hard contact mode the wafer is brought in direct contact with the mask, while positive nitrogen pressure is used to press the substrate against the mask. In hard contact mode a resolution in the 1 micron range is possible.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

In this mode, a vacuum is drawn between mask and substrate during exposure. This results in a high resolution of < 0.8 µm.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

The large gap optics (LGO) optics is optimized for thick resist processes with large exposure gaps and 3D lithography, offering a resolution down to 5μm. The high resolution optics (HR) is apt for contact and close proximity lithography with structures down to 3μm at 20μm exposure gap. For processes with high dose requirements on 150mm wafers the exceptionally high intensity of the W150 HR optics facilitates high throughput.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

The diffraction reducing exposure optics is designed to compensate diffraction effects in both contact and proximity lithography. Instead of using a plane wave as in other proximity lithography tools it provides an angular spectrum of planar light waves to reduce diffraction effects. The selection of a proper angular spectrum improves structure resolution in the resist.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

MO Exposure Optics® is a unique illumination optics specifically designed for SUSS mask aligners. It is based on micro-lens plates instead of macroscopic lens assemblies. A simple plug & play changeover allows for a quick and easy changeover between different angular settings including the functionality of both classical SUSS HR and LGO illumination optics.

The telecentric illumination which is provided by the MO Exposure Optics improves light uniformity and leads to a larger process window. In consequence, this causes yield enhancements. MO Exposure Optics also decouples the exposure light from the lamp source thus small misalignments of the lamp do not affect the light uniformity. A decoupled light source saves setup and maintenance time and guarantees uniform illumination conditions during the full life-time of the lamp.

Highlights

  • Excellent light uniformity over full exposure field
  • Stable light source
  • Customizable illumination by means of illumination filter plate exchange
  • "DUV-ready" process capabilities with fused silica micro optics
  • Special "down-sizing kits" for light compression to smaller wafer sizes

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

SUSS mask aligners are equipped with a WEC head system that allows reaching the parallelism between substrate and mask with a micrometric precision 

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Operator-assisted systems maintain a high degree of process control and reliability in combination with the advantages of manual wafer handling.

Available for:

Semi-Automated Mask Aligner

The mask aligner optionally offers an automatic filter exchange unit for up to four filters that are selected via process recipe. This removes the risk of operator errors and thus improves yield and effective throughput.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

微影製程模擬

微影製程模擬無須使用嘗試錯誤法 (Trial-and-Error-Method) 即可找出最佳製程參數。由 SUSS MicroTec 與製造商 GenISys 共同合作針對微影製程"實驗室"所研發的多功能微影製程模擬軟體主要允許使用者能夠更確實地控制製程。該軟體提供設計及研發,以及校驗與最佳化所須的所有模擬功能。同時涵蓋從光線調整、光罩結構改良到光阻劑處理的所有製程步驟。此外,使用先進的 3D 模擬功能顯示模型。

MO Exposure Optics 輔以特別為 SUSS 光學鏡頭模型所設計的光學鏡片,可進行濾光基板設計的最佳化,並可因此提高圖像的精準度。

特色

  • 完整模擬光罩對準機的微影製程
  • 可調整式光線參數 (準直、光譜成分),針對所有 SÜSS 光學鏡頭所設計
  • 快速、靈活的呈現方式,並可以不同空間度量呈現 ( 1-、2- 和 3-D)

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

可調整曝光和光罩

藉由最佳化光罩和光源 (源於微影技術) 可減少肇因於像差、製程本身以及繞射的成像瑕疵。可調整的濾光基板和光罩結構 (OPC) 使客戶可依其需求強化微影製程的功能性。
模擬平台主要用於建立製程參數如: 光罩結構和曝光參數。如此便可在減少實驗耗費的前提下完成各個生產階段曝光和光罩結構的設定,同時減少像差和製程瑕疵。
來源光罩最佳化與特殊光學 MO Exposure Optics® 光學曝光系統對於改善光罩對準機的光刻穩定性具有決定性的影響

產品各色

  • 使用 MO Exposure Optics 光學曝光系統提供更穩定的光源
  • 透過可更換濾光基板進行光源最佳化
  • 使用光學近接干擾修正 (OPC) 最佳化光罩

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Downloads
MA12 Datasheet 466kb
SUSS Product Portfolio 990kb
Technical Publications
Service