Deutsch: Integrate all hybrid bonding processes

The XBC300 Gen2 D2W/W2W is the only platform to integrate all hybrid bonding processes—W2W, collective D2W, and sequential D2W—into one tool. Developed by SUSS and SET Corporation SA, it offers a reduced footprint and lower costs by eliminating redundant modules. Ideal for advanced 3D stacking applications like SoC and SIC, it enhances flexibility and efficiency in hybrid bonding.