Precision systems for semiconductor lithography, wafer bonding, and photomask processing

From photomask processing to high-precision imaging, coating, and bonding systems: We develop solutions that ensure efficient, stable, and cost-effective processes for high yield and consistent throughput.

Product Overview Brochure

Coating Solutions for flexible, high-yield results

Uniform coatings, stable processes, and flexible adjustments help you optimise production workflows while achieving the lowest total cost of ownership.

Coating & Developing

RCD8 MCS8 LabSpin Series HP8 ECD8 AS8 ACS300 Gen2 ACS200 Gen3 TE ACS200 Gen3

Industrial Inkjet Printing for Semiconductor Manufacturing

JETx LP50

Imaging Solutions for accurate mask alignment

We enable precise mask alignment and optimize throughput, so you can expose complex structures reliably and at high yield.

Mask Alignment

NIL-SFT12 Series NIL-SFT8 Series MJB4 MA300 Gen3 MA200 Gen3 MA12 Gen3 MA/BA Gen4 Series

UV Scanning

DSC300 Gen3

High-precison Bonding Solutions for reliable outcomes

Execute highly precise bonding processes with SUSS’ solutions for temporary, permanent, and hybrid bonding. Built on a scalable, modular platform, our systems adapt to your needs to ensure optimal device quality and maximum yield.

Temporary Bonding

DB12T XBS300 XBC300 Gen2

Permanent Bonding

XBC300 Gen2 SP XB8 XBC300 Gen2 D2W XBS200 XBC300 Gen2 D2W/W2W XBS300 W2W SB8 Gen2

Photomask Solutions for high-yield, future-ready lithography

Rely on next‑generation lithography with our advanced photomask solutions, combining particle‑free cleanliness and tight process control to protect pattern fidelity and yield across EUV and DUV layers.

Bake & Develop

ASx Series Masktrack Smart BD

Cleaning

HMx Series MaskTrack Pro Series

Let’s talk!

Let’s grow innovation together! Tell us about your project and your challenges – so we can come up with a perfect solution.

Get in touch