Temporary bonding and debonding solutions

XBC300 Gen2 Debonder & Cleaner

The XBC300 Gen2 is a versatile platform for debonding and cleaning at room temperature. Designed for tape-mounted wafers and carriers in 200 mm and 300 mm formats, as well as oversized variants, it enables safe handling of ultra-thin device wafers down to 50 µm or below.

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XBC300 Gen2 debonder and cleaner platform by SUSS

Your Benefits

With the XBC300 Gen2, you benefit from a highly modular platform built to meet the complex demands of (EVG) advanced packaging, including 2.5D, 3D IC and Fan-out Wafer-level Packaging (FoWLP) wafers, for power devices, as well as for handling fragile substrates like compound semiconductors and MEMS wafers.

Mechanical Peel-Off With Minimal Mechanical Stress

The DB300T module enables controlled mechanical peel-off debonding using a wide range of adhesives and process-specific release layers. By precisely guiding the debond front, the system ensures minimal mechanical stress on the device wafer throughout the separation process. Compatible with both glass and silicon carriers, this method offers flexible, reliable performance across diverse material stacks.

Laser-Assisted Debonding For Transparent Carriers

The LD300 delivers virtually force-free carrier removal using targeted 308nm excimer laser pulses that selectively break adhesive bonds at the interface. Perfect for transparent carriers like glass or sapphire, this UV-based process eliminates mechanical stress while ensuring precise, clean separation.

Efficient Thinned-Wafer Cleaning

The AR300TF module is designed for efficient, wet-chemical cleaning of thinned wafers mounted on tape. It effectively removes adhesive and releases layer residues while ensuring maximum protection of wafer and tape Separate dispense arms for cleaning and rinsing allow flexible process control, with multiple dispense modes, including puddle, spray, and high-pressure, supported by integrated N₂ drying.

Reliable Carrier Cleaning

The AR300 module enables thorough cleaning of full-thickness wafers and support carriers, with a choice of puddle, spray, or high-pressure application modes. It features integrated backside rinsing to ensure complete removal of contaminants from all surfaces. Like the AR300TF, the module offers separate dispense arms and a range of chemical options.

Your Modular Debonding and Cleaning Platform

Key Features of XBC300 Gen2

Designed to grow with your needs: The modular architecture of the XBC300 Gen2 enables seamless scaling from initial process development to high-volume manufacturing. Supporting a large variety of carrier materials and wafer sizes, the system offers process flexibility at any scale.

Patented Dock and Lock™ Technology

The patented Dock and Lock™ technology enables fast, field-ready upgrades of process modules – making it easy to expand functionality or boost throughput as you move towards volume production.

Patented Tape Protection Ring

The AR300TF module for thinned wafer cleaning is equipped with a patented protective ring that shields the tape and frame throughout the entire process, thus safeguarding critical surfaces and ensuring contamination-free results.

Precise Debond Front Control

The XBC300 Gen2 features a laser-based debonder to control the debond wave front with high precision, enabling the shortest possible debond front and minimized stress on the device wafer. Parameters can be programmed by zone for optimized force distribution across the process.