Transparency is important to us. In our News section you´ll find all recent news and publications around SUSS MicroTec. Our aim is to keep you informed.
Printing sub-micron structures using Talbot mask-aligner lithography with a 193 nm CW laser light source
Polyimide based Temporary Wafer Bonding Technology for High Temperature Compliant TSV Backside Processing and Thin Device Handling
Temporary Bonding and Debonding - An Overview of Today‘s Materials and Methods