Precise surface preparation is essential for reliable Wafer-to-Wafer and Die-to-Wafer hybrid bonding. The XBC300 Gen2 SP supports stable, reproducible processes for 200 mm and 300 mm substrates — from high-performance wet cleaning and plasma activation to in-line IR void detection and integrated metrology.
Designed for both high-volume manufacturing and R&D environments, it helps you integrate scalable surface preparation into existing hybrid bonding ecosystems with confidence.
Visit XBC300 Gen2 SP | SUSS and discover the XBC300 Gen2 SP surface preparation cluster.