Semi-Automated Mask Aligner and Imprint

MA/BA Gen4 Series Mask and Bond Aligner

The MA/BA Gen4 series represents two platforms for semi-automated mask aligner and imprint processing for both standard or high-end applications. Combining proven SUSS lithography technology with new automation and ergonomic features, the system ensures stable performance, enhanced safety, and user-friendly operation for research, pilot production, and demanding process environments.

Talk to an expert

Your Benefits

Designed for intuitive operation and ergonomic ease, the MA/BA Gen4 reduces operator effort and ensures process consistency across MEMS, packaging, and imprint applications

State-of-the-Art Technology

Optimal results for advanced lithography and imprint processes across a wide substrate range: latest alignment techniques, the unique SUSS exposure concept and MO Exposure Optics^® deliver the highest level of alignment and mechanical precision, superior resolution plus environmental sustainability and energy efficiency.

Outstanding Versatility

Available as MA/BA6 Gen4 and MA/BA8 Gen4 for standard processes, or MA/BA Gen4 Pro for advanced and high-end applications, the system delivers excellent, reproducible results from microstructures to nanoscale imprinting. High automation and SMILE technology enable seamless application exploration and scale-up on one versatile platform.

Operator Ease & Comfort

The MA/BA Gen4 series features clear interfaces, guided workflows, and intuitive controls. The ergonomic recipe editor, sophisticated data logging and the ability to assign user rights reduce operator effort, minimize errors, and shorten training time ensuring efficient, comfortable operation even during extended shifts.

Compact Design, Scalable Performance

The scalable bridge between research and production: Identical process modules and software interfaces allow direct process transfer to SUSS’s automated platforms, enabling efficient scale-up and reducing qualification effort in high-volume environments.

Key Features of MA/BA Gen4 Series

Equipped with MO Exposure Optics^® and SUSS latest imprint technologies, the MA/BA Gen4 series delivers optical excellence, precision alignment, and superior resolution. Its modular design supports advanced packaging, MEMS/NEMS, 3D integration, compound semiconductors, LED, micro-optics, AR, and optoelectronics.

Excellent Light Uniformity

MO Exposure Optics^® with telecentric illumination provides superior light uniformity and process stability. Exchangeable aperture plates and customizable illumination deliver flexibility and yield gains for a wide range of lithography and imprint applications.

Highest Level of Alignment Precision

The MA/BA Gen4 series offers top-side, bottom-side, and infrared alignment to handle diverse substrate configurations. Optional DirectAlign^® technology achieves 0.5 µm overlay accuracy through live image detection, ensuring reliable alignment even for complex structures, multilayer stacks, and challenging process conditions.

Excellent Resolution and Pattern Fidelity

Resolution down to 0.8 µm across hard, soft, or vacuum contact modes and a new energy-efficient lamp house set new full-field lithography benchmarks. Integrated simulation with custom SUSS optical models enables process visualization, quantitative predictions, and parameter optimization for optimal results.

Downloads

Looking for more details? Please click below to download the technical datasheet and our product presentation with in-depth product information.

Product Overview Brochure EN

PDF

Questions? Talk to our experts

Let’s grow innovation together! Tell us about your project and your challenges – so we can come-up with a tailor-made solution.

Get in touch

Related products

Discover our portfolio of imaging solutions

MA300 Gen3

The new generation of automated mask aligner platforms for 300 mm and 200 mm wafers designed to address the requirements of modern high-end fabs in a high-volume manufacturing environment.

Learn More