Universal bonding solutions

XB8 Wafer Bonder

The XB8 combines process flexibility with high bond force. Designed for a wide range of bonding processes, this semi-automated system supports bond stacks with wafer sizes up to 200 mm.

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Your Benefits

Temperature, chamber pressure, bond force: The XB8 wafer bonder provides high performance and offers full control over all process parameters – making it ideally suited for both R&D as well as volume production in the fields of MEMS, advanced packaging, 3D integration and engineered substrates.

Operator Safety & Convenience

The XB8 wafer bonder offers advanced process automation to minimize operator influence and maximize repeatability. For example, its closed process chamber features automatic wafer loading, with nitrogen purging during the loading sequence, ensuring optimal cleanliness.

Homogeneous, High-Speed Processing

Thermal decoupling of ceramic heaters enables precise, repeatable temperature control across the wafer. Temperature distribution across the wafer is closely controlled by SUSS’s unique dual-zone heating system.

Three-Zone Force Control

Three-Zone Precision Bonding applies force only where wafer support exists, ensuring perfect homogeneity. The system targets the 100mm wafer area while avoiding the 50mm unsupported perimeter for maximum efficiency.

Ideal for Various Bonding Technologies

Thanks to its broad range of programmable process parameters, the platform provides an ideal environment for a wide variety of bonding technologies—including anodic bonding (including triple stack), fusion bonding (with optional plasma activation), eutectic bonding (Au-Sn and Au-Si), and adhesive bonding (UV- and thermally cured epoxy). Additionally, glass frit bonding, hybrid bonding, metal diffusion bonding, and SLID bonding are also supported.

Key Features of XB8 Wafer Bonder

Versatile high-force bonding

Equipped with a configurable bond chamber, the XB8 adapts easily to changing process requirements. Temperature, bond force, and chamber pressure can all be flexibly controlled by a process recipe to meet your specific production needs.

Individual Spacer Actuation (SSR)

The XB8 enables Sequential Spacer Removal (SSR), giving operators full control over each spacer via the bond recipe. Spacers are removed one after the other, ensuring no clamping force is applied –minimizing wafer shift and enabling precise post-bond alignment.

Bonding Temperatures up to 500°C

The XB8 features independent dual-zone ceramic heaters with active air cooling on both top and bottom sides. With a maximum temperature of 500 °C, it delivers uniform heating, excellent results and maintains control accuracy at setpoint. Ramping speed of up to 30 K / min is possible.

High Vacuum Bonding

The XB8 wafer bonder enables high vacuum bonding with recipe-controlled chamber pressure, adjustable from 3000 mbar abs down to 5×10⁻⁵ mbar. Vacuum levels as low as 5 e⁻⁵ mbar can be reached in under five minutes – ensuring controlled environments for high-precision, contamination sensitive bonding processes.