At SUSS we focus on future-proof solutions for long-term profitability and success solutions for microstructuring applications.
Benefit
In addition to the process modules required for W2W bonding with industry-leading alignment accuracy of < +/- 50nm, the XBC300Gen2 D2W/W2W features an integrated NEO HB die bonder from technology partner SET Corporation SA, offering +/-100nm alignment accuracy.
Benefit
In addition to the process modules required for W2W bonding with industry-leading alignment accuracy of < +/- 50nm, the XBC300Gen2 D2W/W2W features an integrated NEO HB die bonder from technology partner SET Corporation SA, offering +/-100nm alignment accuracy.
Benefit
In addition to the process modules required for W2W bonding with industry-leading alignment accuracy of < +/- 50nm, the XBC300Gen2 D2W/W2W features an integrated NEO HB die bonder from technology partner SET Corporation SA, offering +/-100nm alignment accuracy.
Benefit
In addition to the process modules required for W2W bonding with industry-leading alignment accuracy of < +/- 50nm, the XBC300Gen2 D2W/W2W features an integrated NEO HB die bonder from technology partner SET Corporation SA, offering +/-100nm alignment accuracy.
Benefit
In addition to the process modules required for W2W bonding with industry-leading alignment accuracy of < +/- 50nm, the XBC300Gen2 D2W/W2W features an integrated NEO HB die bonder from technology partner SET Corporation SA, offering +/-100nm alignment accuracy.
Benefit
In addition to the process modules required for W2W bonding with industry-leading alignment accuracy of < +/- 50nm, the XBC300Gen2 D2W/W2W features an integrated NEO HB die bonder from technology partner SET Corporation SA, offering +/-100nm alignment accuracy.
At SUSS we focus on future-proof solutions for long-term profitability and success solutions for microstructuring applications.
Benefit
In addition to the process modules required for W2W bonding with industry-leading alignment accuracy of < +/- 50nm, the XBC300Gen2 D2W/W2W features an integrated NEO HB die bonder from technology partner SET Corporation SA, offering +/-100nm alignment accuracy.
Benefit
In addition to the process modules required for W2W bonding with industry-leading alignment accuracy of < +/- 50nm, the XBC300Gen2 D2W/W2W features an integrated NEO HB die bonder from technology partner SET Corporation SA, offering +/-100nm alignment accuracy.
Benefit
In addition to the process modules required for W2W bonding with industry-leading alignment accuracy of < +/- 50nm, the XBC300Gen2 D2W/W2W features an integrated NEO HB die bonder from technology partner SET Corporation SA, offering +/-100nm alignment accuracy.
Benefit
In addition to the process modules required for W2W bonding with industry-leading alignment accuracy of < +/- 50nm, the XBC300Gen2 D2W/W2W features an integrated NEO HB die bonder from technology partner SET Corporation SA, offering +/-100nm alignment accuracy.
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