SUSS Showcases Advanced Packaging Innovations at API 2026

Advanced Packaging International 2026 in Yokohama gathers specialists driving the evolution of semiconductor packaging. From heterogeneous integration to system-level design, the event highlights the latest methods and materials shaping next-generation devices.

SUSS will present solutions tailored for the complex demands of modern packaging. Our wafer bonding and lithography systems enable precise alignment, robust integration, and consistent process stability, supporting both development and high-volume production. These technologies help manufacturers transform challenging designs into reliable, scalable processes.

API 2026 is not only a showcase of technology—it’s a space for knowledge exchange and collaboration. Visit SUSS to see how our solutions help turn advanced packaging concepts into practical, high-performance manufacturing workflows.

David Volk will present “Digital Coating: Scalable and Material-Saving Material Deposition,” showcasing innovative approaches to efficient, high-precision material deposition in modern semiconductor manufacturing.