Universal bonding solutions

SB8 Gen2 Wafer Bonder

Flexible, adaptable, reliable: SB8 Gen2 is a semi-automated universal wafer bonding system, capable of handling wafers up to 200 mm and supporting substrates in various shapes and sizes.

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Your Benefits

Easy to scale and supporting a wide range of bonding technologies, the SB8 Gen2 is a flexible platform designed for various applications and process environments. Its application areas include packaging as well as structuring processes in MEMS, LED, advanced packaging, 2.5D integration, and 3D integration.

Easy to Adapt, Fast to Scale

The SB8 Gen2 is designed for seamless transitions from R&D to pilot lines to full-scale production. Bond tooling – such as open or closed – can be changed quickly, enabling rapid adjustments for different wafer sizes and bonding processes.

Ideal for Various Bonding Technologies

Thanks to its broad range of programmable process parameters, the platform provides an ideal environment for a wide variety of bonding technologies – including anodic bonding and anodic triple stack bonding, fusion bonding, eutectic bonding, adhesive bonding and diffusion bonding.

Compact Footprint, High Performance

With a footprint of 0.6 m x 1.2 m, the SB8 Gen2 is exceptionally space-efficient – designed to fit effortlessly into your production environment.

Your Universal Wafer Bonding System

Key Features of SB8 Gen2 Wafer Bonder

Equipped with an adjustable, high performance bond chamber, the SB8 Gen2 adapts easily to changing process requirements. Temperature control, bond force, and chamber pressure can be flexibly set to meet your specific production needs.

Individual Spacer Actuation (SSR)

The SB8 Gen2 enables Sequential Spacer Removal (SSR), giving operators full control over each spacer via the bond recipe. Spacers are removed one after the other, ensuring no clamping force is applied – minimizing wafer shift and enabling precise post-bond alignment.

Precise Temperature Control

With its wide temperature control range from 30 °C to 500 °C measured directly on the tooling plate surface – SB8 Gen2 guarantees consistent, high-quality results. Ramping speed of up to 30 K / min can be reached.

Uniform Bond Force

The SB8 Gen2 applies bond forces ranging from 300 N to 20 kN, with high repeatability and best possible uniformity. Its precision control system and pneumatic tool piston ensure reliable results across all bonding processes.