Secure and residue-free bonding

Temporary Wafer Bonding Solutions

SUSS Temporary Bonding protects sensitive wafers during complex, multi-step processes – and enables residue-free debonding at critical stages.

Talk to an expert

Bonding built for complex workflows

Confident wafer processing in complex workflows: Our temporary bonding solutions enable easy, residue-free debonding, with no risk to your dies.

Top products

Discover our top products

XBC300 Gen2

Versatile, room-temperature debonding and cleaning platform, designed to meet the requirements of 2.5D and 3D integration processes.

Learn More

XBC300 Gen2 debonder and cleaner platform by SUSS

Automated

XBS300

Automated temporary bonding solution of aligned 200mm and 300mm wafers.

Learn More

Automated

DB12T

State-of-the-art solution for mechanical peel-off debonding at room temperature, perfectly suited for a wide range of thin wafer applications.

Learn More

Semi-automated

Key Benefits

Flexible Carrier Compatibility

Safely bond thin or ultrasensitive wafers with multiple carrier options for total process flexibility in advanced semiconductor and MEMS manufacturing.

Clean Debonding

Secure adhesion in multi-step flows paired with industry-leading, residue-free debonding engineered for contamination-sensitive wafers.

Seamless Multi-Step Processing

Most advanced integration flows, including thinning, lithography, and packaging steps run with ease ensuring the seamless transitions between materials and process stages for high-mix- or complex manufacturing.

Smart Metrology for Optimal Quality

Smart metrology features in SUSS Temporary Bonding platforms enhance safety and process control. By detecting wafer warpage and verifying alignment before debonding, the tools prevent damage, ensure accuracy, and safeguard yield in advanced semiconductor workflows.