Inkjet Printing Solutions

Precise, non-contact deposition with minimal waste: SUSS inkjet printing solutions deliver customized wafer applications, minimize contamination risks, and boost efficiency. Flexible across substrates and scalable from R&D to full production, the systems enable sustainable, cost-effective processes. 

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Efficient printing for complex materials

Clean, selective deposition reduces errors and boosts yield, from lab-scale experiments to full-scale wafer production.

Top products

Discover our top products

LP50

The LP50 is the versatile R&D inkjet printer for functional materials, enabling fast process development and material evaluation
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Manual

JETx

JETx – the most advanced inkjet printing solution for high-volume production of functional materials, specifically designed for the semiconductor and adjacent markets.
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Automated

SUSS Inkjet Printing Solutions

Key Benefits

Micron-level precision

Place functional materials exactly where needed: SUSS inkjet systems deliver high-precision, non-contact deposition for complex wafer designs and customized applications down to 20 micrometers resulting in fewer defects, cleaner processes, and reliable performance from R&D to full-scale production.

Material efficiency

Reduce material usage significantly: SUSS sophisticated inkjet printing features replace traditional techniques like lithography, screen printing, spray coating, and dispensing thus eliminating the need for masks and screens. This enables faster product changeovers, lowers costs, and supports more sustainable production.

Systems for any application

Versatile from lab trials to full-scale production: SUSS inkjet printing systems platforms handle a wide range of substrates and materials. Flexible configurations enable fast adaptation to new applications, maximum throughput, process reliability, and future-proofing operations for evolving technology demands. 

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Integrated metrology for vision control

Vision-optimized inkjet printing: The integrated DI300 module ensures sub-micrometer precision, compensates for substrate shifts, and enables high-throughput, intelligent deposition for maximum yield and minimal scrap.

Real-time vision alignment

In-line fiducial detection corrects shifts and warping, delivering sub-2 µm positioning accuracy.
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Yield-focused deposition control

Dynamic corrections reduce scrap, support custom patterns, and maintain high-throughput production.
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Downloads

Looking for more details? Please click below to download the technical datasheet and our product presentation with in-depth product information.