Semi-Automated Mask Aligner and Imprint

MA12 Gen3 Mask Aligner

The MA12 Gen3 is a semi-automated mask aligner for wafers up to 300mm, combining proven lithography with advanced imprint processing. It delivers cost-efficient exposure, high overlay accuracy, and process flexibility for MEMS, advanced packaging, and R&D.

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Flexible lithography meets effortless operation

The MA12 Gen3 offers versatile lithography capabilities designed to support industrial R&D as well as mid- to large-scale production environments. Its compact design saves cleanroom space while intuitive handling simplifies operation. Featuring SUSS's latest technology, the mask aligner ensures stable, high-quality results and improved imprint processing features for standard, advanced and high-end processes.

Complete Imprint Versatility

Standard to high-end imprint processes across advanced packaging, MEMS, and nanopatterning: Using renowned SMILE technology, the MA12 Gen3 provides accurate processing for full-field lithography in 3D integration, compound semiconductors, LED, micro-optics, AR, and optoelectronic sensors.

Compact Design, Easy Operation

The MA12 Gen3's compact footprint saves costly cleanroom space while providing user-friendly operation. Easy-access components, LED light source, and renowned SUSS MO Exposure Optics^® minimize maintenance, while remote service capability ensures quick, cost-effective issue resolution.

Automated Precision

Smart automation with constant dose mode, automated exposure control, and auto-alignment optimizes process parameters for outstanding results. An intuitive recipe editor and sophisticated data logging ensure maximum stability for pilot lines and R&D applications.

Exceptional Performance Across Demanding Applications

Key Features of MA12 Gen3

The MA12 Gen3 maximizes yield and ensures reproducible results even under challenging conditions. From enhanced leveling and MO Exposure Optics to specialized handling for warped wafers and sensitive materials, every feature is engineered for reliability and performance.

Enhanced SUSS Leveling System

SUSS's advanced leveling system uses direct, real-time gap measurement during stacking to achieve high-precision parallelism between substrates, masks, or stamps ensuring optimal contact and alignment accuracy.

Excellent Light Uniformity

MO Exposure Optics^®, SUSS' unique micro-lens-based illumination, delivers telecentric exposure with exceptional uniformity and a larger process window. Plug-and-play angular settings and decoupled light source design minimize maintenance while guaranteeing consistent performance throughout lamp lifetime.

Optimized Handling for Warped & Sensitive Materials

Specialized toolkits support warped or bowed wafers with effective alignment even on non-flat substrates. Vacuum chucks, soft-contact/proximity exposure modes, and adaptable alignment optics (top-side, bottom-side, IR) protect fragile materials from stress and damage.

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Looking for more details? Please click below to download the technical datasheet and our product presentation with in-depth product information.

Product Overview Brochure EN

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