Fully automated Mask Aligner

MA200 Gen3 Mask Aligner

The MA200 Gen3 is engineered for high-volume automated production of wafers and square substrates up to 200mm. Combining innovative alignment technologies with intelligent automations, it's the system of choice for micro-electromechanical systems (MEMS), radio frequency (RF) and power devices,

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High-volume lithography with sub-micron accuracy

Precision, productivity, and flexibility in one tool: MA200 Gen3 features innovative technology for high accuracy, while flexible process modes and automation secure yield and efficiency for MEMS, 3D patterning, and advanced packaging applications such as 3D integration, fan-out, bumping, compound semiconductors, and image sensors.

High Alignment Precision

For demanding overlay requirements, the MA200 Gen3 features DirectAlign^® with industry-standard PatMax. Using live images instead of stored patterns, it achieves top-side alignment accuracies down to 0.5 µm ensuring exceptional process stability and repeatability ideal for high-volume applications.

Unique Illumination Optics

SUSS´ MO Exposure Optics^® delivers uniform light distribution with unmatched stability. Its plug-and-play design allows fast switching between HR and LGO modes, while telecentric illumination broadens the process window. With customizable filters and downsizing kits for smaller wafers, the system adapts quickly to diverse production requirements.

Versatile Exposure for Sub-Micron Precision

The MA200 Gen3 supports multiple exposure modes to match every process need. Proximity lithography enables fast, cost-effective microstructures down to 3.5 µm, while contact and vacuum exposure achieve sub-micron precision below 0.8 µm. Whether for MEMS, packaging, or image sensor applications, this versatility ensures both flexibility and high resolution without compromising throughput.

Automated Mask Management

The integrated mask library stores and manages multiple photomasks in a controlled environment. Automated selection and activation of the correct layer reduce operator errors and save valuable process time. This streamlines production, increases productivity, and ensures reliable, error-free operation even in high-volume manufacturing.

Performance and Yield

The SUSS compensation system ThermAlign^®stabilizes chuck and mask temperatures during processing, counteracting thermal run-out in real time. By adapting to changing process conditions, it ensures consistent overlay accuracy and higher yield across long production runs.

The mask aligner for advanced packaging

Key Features of MA200 Gen3 Mask Aligner

Engineered for high-volume environments, the MA200 Gen3 combines precision alignment, advanced optics, and versatile handling to deliver stable, reproducible results across diverse lithography and packaging processes.

DirectAlign® Precision

Top-side alignment accuracy of 0.5 µm with DirectAlign^®, the SUSS enhanced functionality for structure detection software delivers outstanding overlay performance for demanding production requirements.

Flexible Exposure Modes Down to <0.8 µm

The MA200 Gen3 adapts to every resolution needed – from fast proximity lithography to sub-micron vacuum contact. It enables structures down to 3.5 µm on 200 mm wafers and <0.8 µm in vacuum mode for maximum flexibility and precision.

Secure Handling of Fragile Substrates

Interchangeable tooling ensures safe processing of fragile, warped, or ultra-thin wafers down to 50 µm. Edge handling carriers protect double-sided structures, securing yield and throughput in advanced applications.

Downloads

Looking for more details? Please click below to download the technical datasheet and our product presentation with in-depth product information.

Product Overview Brochure EN

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MA200 Gen3 Datasheet

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