Imaging Systems

DSC300 Gen3 Projection Scanner

The DSC300 Gen3 is SUSS’s fully automated, high-throughput solution for projection lithography in advanced packaging on 300 and 200mm wafers. Featuring proprietary scanning technologies, it combines elevated performance, cost efficiency, and high process versatility.

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Projection lithography for advanced packaging

Full-field exposure and proprietary scanning provide precise pattern transfer and consistent process results. Adjustable optics and configurations support a wide range of advanced packaging applications, offering a cost-effective alternative to stepper-based lithography.

Stitchless exposure for consistent yield

Full-field imaging and proprietary scanning ensure defect-free lithography without step-field size or design restrictions driving faster process cycles and consistently high yield.

Top Cost, Top Efficiency

Triple-digit throughput combined with minimized overhead time: delivering stable performance regardless of die size or layout make the DSC300 Gen3 a productive and cost-efficient 1X projection scanner platform.

Universal Optical Flexibility

Recipe-selectable numerical apertures and multiple exposure wavelengths enable adaptation from fine 2 µm lines and spaces to thicker resist layers. Depending on line-to-space ratios, smaller pattern sizes are achievable, ensuring accurate imaging for a variety of application.

Advanced Packaging Results

Achieve 2/2 µm resolution with <1 µm overlay, precise temperature control, and die shift compensation of ± 200 ppm: the DSC300 Gen3 ensures contamination-free processing and high accuracy even for most demanding packaging applications.

Key features of DSC300 Gen3

Engineered for advanced packaging applications

Built on advanced Wynne-Dyson optics, the DSC300 Gen3 delivers precise imaging, robust alignment, and flexible substrate handling. This ensures the precision, yield, and adaptability needed for wafer-level packaging, fan-out, and 2.5D/3D integration.

Superior optics with 2 µm resolution and high DOF

Wynne-Dyson optics achieve 2/2 µm resolution with multiple NAs to balance resolution and depth of focus. Broadband filters, symmetric design, and chromatic error correction deliver excellent uniformity and imaging quality for advanced packaging.

<1 µm Overlay Accuracy plus Die Shift Compensation

Optical alignment delivers ≤ 1.0 µm overlay accuracy, supported by off-axis and IR options. Proprietary magnification correction and beam steering provide fast die shift compensation, eliminating thermal lag errors for consistent wafer-to-wafer performance.

Broad Substrate & Warpage Handling

Designed for 300 mm wafers (200 mm optional), the DSC300 Gen3 also processes silicon, glass, and SiC substrates. It supports warpage up to 2 mm bow, offering flexibility for diverse advanced packaging applications.

Downloads

Looking for more details? Please click below to download the technical datasheet and our product presentation with in-depth product information.

Product Overview Brochure EN

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DSC300 Gen3 Brochure

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