Photomask Processing Platform

ASx Series Photomask Processing Platform

Maximize yield and quality: The ASx Series is the fully automated photomask processing platform for advanced bake, resist strip & clean, and develop processes on 250 nm to 65 nm wafers in one system.

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Outstanding performance, compact design

The ASx Series combines industry-leading precision with maximum reliability and performance to meet the critical challenges of defect-free processing of masks exposed to 248nm and 193nm lithography. All this with superior cleaning efficiency and unmatched cost of ownership.

Best-in-class Cleaning Yield

With its superior first-pass cleaning yield, the ASx Series extends mask life and lowers production costs thanks to industry-proven cleaning technologies.

Industry-Leading Footprint

Compact footprint: with 1200 × 1200 mm, the ASx Series enables maximum space utilization and lower cost of ownership – without compromising premium processing performance.

State-of-the-Art Advanced Bake

Advanced bake technology qualified down to 14nm node and beyond ensures photomasks meeting the most demanding specifications for next-generation lithography applications.

Smart Automation

The clustered design with integrated Advanced Post-Exposure Bake (AEP), chemical filtration, precise climate control and monitoring features ensures highly controlled PEB steps, ensuring maximum process stability, reliable results, and superior mask quality.

Engineering precision meets manufacturing excellence

Key Features of ASx Series Photomask Processing Platform

The ASx Series delivers uncompromising technical performance through intelligent temperature control, automated process optimization, and defect-minimizing development technologies thus transforming complex photomask processing into consistent, industry-leading results.

25-Zone Hotplate System

The intelligent hotplate system allows for precision temperature uniformity on the photomask surface during mean temperature ramp-up and at target temperature ensuring optimal post-exposure bake and high-quality results.

Automated Process Optimization

Built-in algorithms automatically fine-tune bake performance across 90 – 130 °C, ensuring precise CD-mean-to-target control and consistent mask quality.

Lowest-Defect Developing

The A+ nozzle dispense system distributes developers evenly across the entire mask, while active degassing prevents micro-bubbles – ensuring minimal defects and maximum yield.