Organization

The SUSS MicroTec Group is a leading supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience. 

Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.

The production of memory chips, cameras for mobile phones or tire pressure sensors – the equipment solutions of SUSS MicroTec are applied within a wide variety of manufacturing processes for applications of daily or industrial use. Customers in the semiconductor industry and related markets like Advanced Packaging, MEMS and LED appreciate our comprehensive experience in wafer processing. This makes us a valuable partner for high-volume production as well as for research and development.

 

Our product portfolio

Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components. 

 

Locations

The corporate headquarters of SÜSS MicroTec AG is located in Garching near Munich, Germany. The group encompasses production sites as well as sales offices in Asia, Europe and North America.

SUSS MicroOptics SA
Rouges Terres 61
Hauterive 2068
Switzerland

Tel. +41 32 566 44 44
Email: sales.smo@suss.com

Garching / Germany

SUSS MicroTec Lithography GmbH
Schleißheimer Straße 90
85748 Garching
Germany
Tel.:+49 89 32007 0
Fax: +49 89 32007 162

Sternenfels / Germany

SUSS MicroTec Photomask Equipment GmbH & Co. KG
Ferdinand-von-Steinbeis-Ring 10
75447 Sternenfels
Germany
Tel.: +49 7045 41 0
Fax:  +49 7045 41 101

Switzerland

SUSS MicroOptics
Rouges-Terres 61
CH 2068 Hauterive
Switzerland
Tel: +41 32 566 44 44
Fax: +41 32 566 44 99
E-mail: info@suss.ch

United Kingdom

SUSS MicroTec Ltd.
c/o KCAccounts Limited
Runswick, Louth Road, East Barkwith,
Market Rasen, LN8 5RX
United Kingdom
Tel.:    +44 1673 858 485
Mobile: +44 7856 364 992

France

SUSS MicroTec S.a.r.l.
74A Boulevard de l’Europe BP 13
69491 Pierre-Bénite Cedex
France
Tel.: +33 966 903 163
Fax: +33 426 999 461

Greece

International Technology Corporation
7 Mikras Asias Str.
55132 Thessaloniki
Greece
Tel.: +30 23 104 47009
Fax: +30 23 104 35868
Email: sargyitc@otenet.gr

Ireland

Inseto (UK) Limited
Unit 25 Focus Way, Andover, SP10 5NY 
United Kingdom 
Tel: +44 1264 334505
Fax: +44 1264 334449
E-mail: enquiries@inseto.co.uk
Web: www.inseto.co.uk

Israel

PicoTech
20 Hamagshimim St.
PO Box 7262
49170 Petach Tikva
Israel
Tel.: +972 3 635 6650
Fax: +972 3 635 7750
E-mail: info@picotech.co.il
Web: www.picotech.co.il

Italien

Electron Mec
Via Negroli 51
20133 Milano
Italy
Tel.:+39 02 7611 0156
Fax: +39 02 7611 0243
E-mail:luigi.calligarich@electron-mec.com
Web:www.electron-mec.it

Russian Federation

TBS
Kiyevskaya str. 7
Moscow 121059 
Russian Federation
Tel.:+7 495 287 8577
Fax: +7 495 287 8577
E-mail:infos@tbs-semi.ru
Web:www.tbs-semi.ru

Serbia

PLUS FOUR
Mr. Dejan Cvjetkovic
11000 Beograd
Republic of Serbia
Tel.: +381 11 2835 071
Fax: +381 11 2835 265
E-Mail: sales@plusfour.eu

South Africa

Saetra (Pty) Ltd
625 Parkade Build. Schoeman Street
PO Box 959
South Africa
Tel.: +27 12 345 3134
Fax: +27 12 345 1465
E-mail:enquiry@saetra.co.za
Web:www.saetra.co.za

Spain and Portugal

SMA - Suministro De Materiales Y Asistencia S.L.
C/Caracas 6, Tres Cantos
28760 Madrid
Spain
Tel.:+34 91 8033 186
Fax: +34 91 8038 685
E-mail:smasl@arrakis.es

Switzerland

Hilpert electronics AG
Täfernstrasse 29
CH-5405 Baden-Dätwil
Switzerland
Tel.:+41 56 483 25 25
Fax: +41 56 483 25 20
E-mail:office@hilpert.ch
Web:www.hilpert.ch

Turkey

MEMS Dis Ticaret Ltd. Sti.
2128 Sokak No. 11/1 , Mustafa Kemal Mahallesi Cankaya
06460 Ankara
Turkey
Phone:+90 312 2199 401
Fax: +90 312 2199 402
E-mail: mehmet.turken@mems.com.tr
Web: www.mems.com.tr

Czech Republic

SPECION s.r.o.
Budějovická 1998/55
140 00 Praha 4
Czech Republic
Tel.: +420 244 402 091
Fax: +420 244 460 379
E-mail: gaba@specion.biz
Web: www.specion.biz

United Kingdom

Inseto (UK) Limited
Unit 25 Focus Way, Andover, SP10 5NY 
United Kingdom 
Tel: +44 1264 334505
Fax: +44 1264 334449
E-mail: enquiries@inseto.co.uk
Web: www.inseto.co.uk

Corona

SUSS MicroTec Inc.
220 Klug Circle
Corona, CA 92880-5409
USA
Tel.: +1 951 817 3700
Fax: +1 951 817 0640

China

SUSS MicroTec (Shanghai) Co. Ltd.
Room 3703, Nanzheng Building
580 Nanjing West Rd.
200041 Shanghai
China
Tel.: +86 21 52340 432
Fax: +86 21 52340 430

Japan

SUSS MicroTec KK
KDX381 5F A-1,3-8-11 Shin-Yokohama, Kohoku-ku
Yokohama, Kanagawa
222-0033 Japan
Tel: +81 45 475 3556
Fax : +81-(0)45-474-2885
Sales Contact: info@suss.jp

Korea

SUSS MicroTec Korea Co., Ltd.
Dongtan Paragon Building 2
2nd Floor Office 202
Bansong Dong 106-1
Hwaseong City
Korea
Tel.: +82 31 8015 3950
Fax: +82 31 8015 3951

Singapore

SUSS MicroTec (Singapore) Pte Ltd
21 Bukit Batok Crescent,
Wcega Tower, #12-79
Singapore 658065
Tel.: +65 6271 5780
Fax: +65 6570 1662

Taiwan

SUSS MicroTec (Taiwan) Co., Ltd.
8F-11, No. 81, Shui-Lee Rd.
300 Hsinchu
Taiwan
Tel.: +886 351 690 98
Fax: +886 351 692 62    

Australia

Coltronics Systems Pty., Ltd.
1/272 Victoria Street
N.S.W. 2164 Wetherill Park
Australia
Tel.: +61 2 9604 7355
Fax: +61 2 9604 3028
Email:sales@coltronics.com.au
Web:www.coltronics.com.au

Hong Kong

Micro-Power (H.K.) Semiconductor Ltd.
Flat 1712, 17/F., Metropole Square, 2 On Yiu Street, Shatin, N.T.
Hong Kong
Hong Kong
Tel.: +852 2632 7784
Fax: +852 2632 7005
E-mail: kmlo@micropower.com.hk

India

Indo French High Tech Equipment
308, 3rd Floor, Woodrow Building, Veera Desai Road, Andheri (West)
Mumbai - 400 053
India
Tel.:+91 22 4095 3901
Fax: +91 22 4023 2113
E-mail:brsharma@iheindia.com
Web: www.ihe.org.in

India

OMScientific Private Limited
A/2 Runwal Paradise, Right Bhusari Colony,
Paud Road, Kothrud,
Pune 411038, India
Tel.: +91 997 051 3862
Tel.: +91 986 777 0801
E-mail: info@omscientific.com
Web: www.omscientific.com

Japan

Kanematsu PWS LTD.
925 Nippa, Kohoku-ku, Yokohama, Kanagawa
223-0057 Japan
Tel: +81 45 544 1811
Fax: +81 45 544 2500
Web : http://www.pwsj.co.jp
Service Contact : suss_service@pwsj.co.jp
Sales Contact : suss_sales@pwsj.co.jp

Korea

SCINCO CO., LTD.
Scinco Building, 627, Bongeunsa-ro, Gangnam-gu,
Seoul, 135-873, Korea
Tel.: +82 2 2143 8210
Fax: +82 2 2143 8352
E-mail: jay@scinco.com

Malaysia

ZMC Technologies Pte. Ltd.
No. 1-3-23, Krystal Point 2, Lebuh Bukit Kecil 6, Bayan Lepas
11900 Penang
Malaysia
Tel.: +60 4 646 4586
Fax: +60 4 646 6427
E-mail: yf_lau@zmc.net
Web: www.zmc.net

Philippines

ZMC Technologies (Phils) Inc.
South Center Tower, Unit 503, 5th Floor, 2206 Market Street, Madrigal Business Park, Alabang 1770
Muntinlupa City
Philippines
Tel.: +632 842 5081 | +632 842 9327
Fax: +632 842 5288
E-mail: jack_cada@zmc.net
Web: www.zmc.net

Singapore

ZMC Technologies (Singapore) Pte. Ltd.
10 Ubi Cresent #05-92/93/94/95
Lobby E, Ubi Techpark
408564 Singapore
E-mail: valerie_leong@zmc.net

Vietnam

TST Trading Service Technology Co., Ltd.
68 Nguyen Van Dau St., Binh Thanh Dist.
Ho Chi Minh City
Vietnam
Tel.: +84 8 5500 263/5500 264 (Ext: 39)
Fax: +84 8 5500 262
E-mail: bahoang@tstvn.com
Web: www.tstvn.com

管理层

 

Managing Board

Dr. Franz Richter

Chief Executive Officer (CEO)*

Upon completion of his mechanical engineering studies at the University of Applied Sciences at Münster as well as Physics at the University Bielefeld and the University of Applied Science Darmstadt, Dr. Richter started out on his professional career at the research and development department at Carl Zeiss. In 1988 he moved on to the research and development of the Fraunhofer Institute. Following his professional activities as a scientist at the Carl Zeiss Group and the Fraunhofer Institute, he spent 14 years working for SUSS MicroTec, the last six of them as its CEO until 2004. During this time, the IPO took place and revenue grew beyond 200 million Euro. After serving as President of Semiconductor Equipment Division at Unaxis (now OC Oerlikon) in Pfäffikon, Switzerland, he set up Thin Materials AG and became its CEO in 2007. The company is engaged in the process development for the 3D chip integration and was successfully sold to Nissan Chemical Industries, Ltd.,Tokyo, in 2013.

Today Dr. Richter serves as a member of the supervisory board of the stock listed Siltronic AG, Munich, Germany, the administrative board of Meyer Burger Technology AG, Gwatt, Switzerland and the COMET Holding AG, Flamatt, Switzerland. Additionally he is the president of the board of directors at Scint-X AB, Stockholm, Sweden.

* As of September 7, 2016, appointed until September 6, 2019

Walter Braun

Chief Operating Officer (COO)*

Walter Braun studied product engineering at Furtwangen University subsequent to an apprenticeship in mechanical engineering at Koch Pac Systeme. After obtaining his degree he started in mechanical construction and as project manager at frogdesign Inc. in Sunnyvale, USA. Picked for their talent pool he moved on to Homag AG in Schopfloch in 1999. Leading various projects he finally took on responsibility for managing the assembly group. In 2001 he managed the technical organization of Homag Machinery in Shanghai, China, and got appointed managing director in 2002. Returning to Germany in 2010 he moved on to Manz AG headquartered in Reutlingen and took the position as VP Operations. He promoted the third-party business (contract manufacturing) and restructured operations for entering new business areas.

Previous to his appointment into the management board of SÜSS MicroTec AG Walter Braun was member of the extended board at Manz AG.

* since Juli 1, 2014, appointed until June 30, 2020

Supervisory Board

Dr. Stefan Reineck

Chairman of the Supervisory Board*

Dr. Stefan Reineck began his career at LEYBOLD AG, an international plant construction company for the semiconductor and data storage industry, where he ultimately held the position of Division Manager for Data Storage Technology Facilities. This holder of a doctorate in physics subsequently assumed management control of Quartz Crystal Technology GmbH, a small-to-medium-sized manufacturer of equipment for the telecommunications industry. From 2002 to 2006, he served as Spokesman of the Management Board of STEAG HamaTech AG, which specializes in the production of optical storage media and photomasks. After leaving this position, he became a management consultant. From April to September 2007, Dr. Stefan Reineck was an interim member of the Management Board of SUSS MicroTec AG before joining its Supervisory Board in October 2007.

Dr. Reineck is a member of the following supervisory boards and comparable domestic and foreign boards of directors:

  • AttoCube Systems AG, Munich, Germany
  • Wittenstein AG, Igersheim, Germany
  • Phoseon Technology Inc., Hillsboro, Oregon, USA


* Member of the supervisory board since October 1, 2007. Chairman of the supervisory board since June 2009. Elected until 2022

 

Jan Teichert

Deputy Chairman of the Supervisory Board*

Jan Teichert began his career at a well-known accounting and auditing firm in Munich, Germany. In 1999, the business graduate transitioned from auditing to the operational business of the globally-oriented, stock exchange-listed Lindner Holding KGaA. There, he acted as authorized representative for finance and made a substantial contribution to the successful realignment of the finance department. Since January 2003, he has been a member of the Board of directors of Einhell Germany AG, where he serves as Chief Financial Officer.

* Member of the supervisory board since June 19, 2008. Deputy chairman of the supervisory board since June 2009. Elected until 2022

 

Gerhard Pegam

Member of the Supervisory Board*

Gerhard Pegam was President and Chief Executive Officer (CEO) of EPCOS, a world-leading manufacturer of electronic components, modules and systems, headquartered in Munich, Germany until Januar 31, 2012. He was also a Member of the Board of Directors of the holding company TDK-EPC Corporation, which was established in 2009 as a result of the merger of EPCOS with the components business of the Japanese electronics company TDK Corporation.

Gerhard Pegam looks back to almost 30 years of experience in the Electronics Industry. After graduating in electrical engineering in 1981 he started his professional career as development engineer at Philips in Austria in 1982. In 1985 he moved on to Siemens, were he held various management positions within the passive components sector. In 1999 Gerhard Pegam became a member of the Management Board of EPCOS AG, a spin off from Siemens. He assumed the position of Chief Operating Officer before he was appointed Chief Executive Officer in 2001.

Gerhard Pegam is a member of the Board of Directors of OC Oerlikon Corporation AG and Schaffner Holding AG.

* since June, 2011. Elected until 2022

 

财务数据

  in € million 2015  2014  2013  2012  2011  2010 
 Business Development                   
  Order entry 188.6   134.3   135.0   157.2   143.1   189.3  
  Order backlog as of December 31 117.6   75.6   85.7   86.5   83.7   116.1  
  Total Sales 148.5   145.3   134.5   163.8   175.4   139.1  
  Sales margin 0.1%   3.2%   (11.9%)   4.6%   7.9%   9.3%  
  Cost of sales 99.2   96.5   112.7   106.4   109.0   88.0  
  EBITDA 9.2   12.6   (13.4)   18.6   24.9   20.5  
  EBITDA margin 6.2%   8.7%   (10.0%)   11.4%   14.2%   14.7%  
  EBIT 5.0   8.4   (19.4)   11.7   18.6   14.3  
  EBIT margin 3.4%   5.8%   (14.4%)   7.1%   10.6%   10.3%  
  Earnings after tax 0.2   4.6   (16.0)   7.6   13.8   13.0  
  Earnings per share (in €) 0.01   0.24   (0.84)   0.40   0.72   0.71  
 Balance Sheet and cash flow                   
  Equity 118.7   116.1   109.4   127.2   120.4   106.4  
  Equity ratio 67.0%   69.1%   60.8%   70.5%   64.1%   58.6%  
  Balance sheet total 177.2   168.0   179.9   180.4   187.7   181.6  
  Net cash 40.0   38.0   35.7   32.3   42.0   34.6  
  Free cash flow1 1.3   2.1   4.1   (4.5)   3.5   14.1  
 Further key figures                   
  Investments 3.4   3.0   12.2   4.2   3.4   3.0  
  Investment ratio 2.3%   2.1%   9.1%   2.6%   1.9%   2.2%  
  Depreciation 4.2   4.2   6.0   6.8   6.4   6.2  
  Employees as of December 31 698   659   655   704   624   616  


1 Before consideration of purchase or sale of availabe for sale securities

历史

In 1949 Karl Süss founds a sales representation for microscopes, cameras and laboratory equipment of Ernst Leitz Wetzlar in Munich. A garage is the first headquarter for the new business in post-war Germany. Soon the Karl Süss GmbH also provides service and maintenance for the optical devices thus quickly gaining reputation within the research community.

When Munich-based Siemens approaches Süss in 1962 and asks the company to produce a thermo-compression bonding machine for transistors this marks a tipping point in its history: The company moves from sales and maintenance to contract manufacturing. The first order comprises small measuring tables with stereo microscopes that are bonded together. One year later a second order follows and in 1963 Süss develops the prototype for the first mask aligner, the MJB3, for Siemens.

Karl Süss and his two sons Ekkehard and Winfried successfully expand the flourishing manufacturing business. The company soon needs to move its premises outside of Munich to Garching, where headquarters are still situated today.

While the semiconductor industry grows various other business opportunities are appearing. Süss starts producing test systems and diamond scribers.

The first double-side mask aligner allowing for dual-side exposure gets invented in 1974.  Having proven itself an acknowledged expert in photolithography for its partners in research and development Süss now tackles manufacturing customers. In 1975 it introduces with the MJB55 a first mask aligner for volume production.

The eighties are marked for Süss by a worldwide expansion. Süss launches its oversea business first with a site in the US, Waterbury, Vermont. Next, an Asian subsidiary is founded in Thailand in 1983, with more sales offices in Japan, China and Taiwan to follow. 

Süss gets ready for the production of bonders, additionally undertaking a side step into the very specialized field of xray stepper lithography. In Dresden, Germany, Süss opens a production site for probers.

Süss meets the growing demands for microsystems by releasing its first substrate bonder in 1989. Substrate bonders are used in microsystem technology to join heterogenous materials with patterned surfaces. In 1993 Süss adds device bonders to its product portfolio.

In 1994 Karl Süss and his eldest son Ekkehard Süss desease shortly one after the other. This sets off a reorganisation. The company is going public in 1999.  The Süss family remains represented in the advisory board by Karl Süss' son Dr. Winfried Süss. Two years later a name change for all legal Süss entitites into SÜSS MicroTec follows the new organisational form.

By the acquisition of Fairchild Technologies the company gains access to high-end markets with production coaters in 2000. In the year 2001 the microoptics business of the newly founded SUSS MicroOptcs reinforce the lithographic portfolio. In 2006 SÜSS MicroTec establishes its spin-off SUSS MicroTec Reman in the flourishing used equipment market. In 2007 the product line device bonders is sold, two years later the probers. In contrast, the opening of offices in Singapore and Korea strengthen the company's presence in the Asian market.

The recent years are characterized by focussing on core compentencies. In 2010 SÜSS MicroTec purchases Hamatech APE, an equipment supplier for photomask processing technology. In the same year, the newly purchased site in Sternenfels becomes home for the production of substrate bonders which have been moved from Waterbury, US. Coaters, bonders and photomask processing equipment are now being manufactured at the same site which therefore functions a compentence center for wet processing technology. With the acquisition of Tamarack Scientific in 2014 the company complements her lithographic portfolio with modern laser processing technology for microstructuring.

 

Events

SUSS MicroTec is regulary participating in trade fairs and conferences all around the world. Meet our experts and address questions about materials, equipment and processing of your application.
 

SPIE Photomask Technology + Extreme Ultraviolet Lithography
11. - 14.09.2017 | Monterey, California, United States |

Visit SUSS MicroTec at the SPIE Photomask Technology + Extreme Ultraviolet Lithography conference and discuss latest developments and future directions of mask makers, EUVL and emerging technologies. Meet our experts and address questions about materials, equipment and processing of your application. For more information visit http://spie.org/conferences-and-exhibitions/photomask-technology--extreme-ultraviolet-lithography-2017.

SEMICON Taiwan
13. - 15.09.2017 | Taipei, Taiwan |

Visit SUSS MicroTec at SEMICON Taiwan and discuss latest developments and future directions of packaging, components and microelectronic systems. Meet our experts and address questions about materials, equipment and processing of your application. For more information visit http://www.semicontaiwan.org/en/.


Don't Miss the Opportunity to Attend our Presentations


Advanced Packaging Technology Symposium   |   Wednesday, September 13   |   14:25

SUSS High Throughput UV Projection Scanner with optimized Performance for FOWLP Application
Dr. Markus Arendt, SUSS MicroTec



MEMS & Sensors Forum   |   Thursday, September 14   |   10:45

Novel Method for Improved Post-Bond Alignment in Wafer Bonding for High Volume Production of MEMS Sensors for Automotive- and Consumer Applications
Margarete Zoberbier, SUSS MicroTec
European MEMS & Sensors Summit
20. - 22.09.2017 | Grenoble, France | 7

Visit SUSS MicroTec at European MEMS & Sensors Summit in Grenoble, France and discuss latest developments and future directions of packaging, components and microelectronic systems. Meet our experts and address questions about materials, equipment and processing of your application. For more information visit www.semi.org

MikroSystemTechnik Kongress
23. - 25.10.2017 | Munich, Germany |

Visit SUSS MicroTec at MikroSystemTechnik Kongress in Munich, Germany and discuss latest developments and future directions of packaging, components and microelectronic systems. Meet our experts and address questions about materials, equipment and processing of your application. For more information visit www.mikrosystemtechnik-kongress.de

 

Don't Miss the Opportunity to Attend our Presentation

High Intensity UV-LED Mask Aligner for Applications in Industrial Research
Katrin Schindler and Thomas Striebel (SUSS MicroTec); Christina Lopper (Fraunhofer IZM, Germany); Paul Kaiser and Ulrike Schömbs (SUSS MicroTec)
 
IWLPC
24. - 26.10.2017 | San Jose, CA, USA | 13

Visit SUSS MicroTec at the International Wafer-Level Packaging Conference IWLPC and discuss latest developments and future directions of packaging, components and microelectronic systems. Meet our experts and address questions about materials, equipment and processing of your application. For more information visit http://www.iwlpc.com.

 

Don't Miss the Opportunity to Attend our Presentation

Session 4 - WLP Processes   |   Tuesday, October 24   |   2:30pm

Electrical and Reliability of Ultra-fine Line Multi-Redistribution Layers Enabled by an Innovative Excimer Laser Dual Damascene Process for Wafer-Level Packaging
Habib Hichri, SUSS MicroTec Photonic Systems Inc.