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先进的研发用喷墨打印机
印刷电路板（PCB）生产用喷墨打印机
大规模生产用喷墨打印机
Automated Platform for Wafers of up to 300mm
用于晶圆片级封装的旋涂/显影一体机
Automated Platform for Wafers up to 200mm
适用于崎岖表面的手动喷雾涂胶机
RCD8涂胶显影平台
Labcluster for laboratories, start-ups and small-scale production
实验室涂胶显影方案，最大尺寸6”到8”
12英寸喷淋显影系统
手动12英寸金属剥离系统
Highly Automated Platform for 300mm and 200mm Wafers
应用广泛的对准和曝光工艺
Automated Platform for Wafers up to 100mm or 150mm
用于工业研究和低成本生产的手动光刻机
For Industrial Research and Operator-Assisted Production
Semi-Automated Platform for Wafers up to 8"/200mm
小尺寸基片的最新研发解决方案
Alignment Measurement for Double-sided Substrates
Automated Platform for Wafer Sizes up to 200 mm
更灵活的开放平台
适用于大批量生产的通用型临时键合机
Manual Bond Aligner Wafer Sizes up to 8"/200 mm
High Precision Bond Aligner
Semi-Automated Excimer Laser Debonder
Semi-automated Tool for Permanent Wafer Bonding of Wafers up to 8"/200 mm
用于高粘结力晶片粘结过程的
Next-Generation Lithography | Clean, Bake and Develop
Photomask Processing Plattform for Advanced Bake, Resist Strip & Clean and Develop
Manual Photomask Equipment with Fully Automated Processing
高品质微光学元件
二手设备认证
SUSS培训中心-知识分享