SUSS MicroTec提供丰富的产品线和工艺解决方案,以满足半导体工业以及相关市场的需求。我们的翻新产品和服务同样享有可靠的质量保证。
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SUSS MicroTec Product Portfolio

LP50

先进的研发用喷墨打印机

NEW PRODUCT
JETx-M

印刷电路板(PCB)生产用喷墨打印机

NEW PRODUCT
JETx

大规模生产用喷墨打印机

NEW PRODUCT
ACS300 Gen3 Coater & Developer

Automated Platform for Wafers of up to 300mm

ACS300 Gen2 Coater & Developer

用于晶圆片级封装的旋涂/显影一体机

ACS200 Gen3 Coater & Developer

Automated Platform for Wafers up to 200mm

AS8 and AS12 Coater

适用于崎岖表面的手动喷雾涂胶机

RCD8 Coater & Developer

RCD8涂胶显影平台

MCS8 Manual Coating System

Labcluster for laboratories, start-ups and small-scale production

LabSpin Series Spin Coater & Developer

实验室涂胶显影方案,最大尺寸6”到8”

AD12 Developer

12英寸喷淋显影系统

SD12 Developer & Cleaner

手动12英寸金属剥离系统

MA300 Gen2 Mask Aligner

Highly Automated Platform for 300mm and 200mm Wafers

MA200 Gen3 Mask Aligner

应用广泛的对准和曝光工艺

MA100/150e Gen2 Mask Aligner

Automated Platform for Wafers up to 100mm or 150mm

MA12 Mask Aligner

用于工业研究和低成本生产的手动光刻机

MA/BA 4 代专业版系列

For Industrial Research and Operator-Assisted Production

MA/BA Gen4 Series Mask and Bond Aligner

Semi-Automated Platform for Wafers up to 8"/200mm

MJB4 Mask Aligner

小尺寸基片的最新研发解决方案

DSM8/200 Gen2 Metrology System

Alignment Measurement for Double-sided Substrates

XBS200 Wafer Bonder

Automated Platform for Wafer Sizes up to 200 mm

XBC300 Gen2 Debonder & Cleaner

更灵活的开放平台

XBS300 Temporary Bonder

适用于大批量生产的通用型临时键合机

BA Gen4 Series Bond Aligner

Manual Bond Aligner Wafer Sizes up to 8"/200 mm

BA8 Gen4 Pro Bond Aligner

High Precision Bond Aligner

LD12 Debonder

Semi-Automated Excimer Laser Debonder

SB6/8 Gen2 Wafer Bonder

Semi-automated Tool for Permanent Wafer Bonding of Wafers up to 8"/200 mm

XB8 Wafer Bonder

用于高粘结力晶片粘结过程的

MaskTrack Pro Series

Next-Generation Lithography | Clean, Bake and Develop

ASx Series

Photomask Processing Plattform for Advanced Bake, Resist Strip & Clean and Develop

HMx Series

Manual Photomask Equipment with Fully Automated Processing

Micro-Optics

高品质微光学元件

再制造设备

二手设备认证

工艺技术
服务

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