SUSS at ECTC 2026

SUSS will be part of the IEEE 76th Electronic Components and Technology Conference (ECTC), taking place May 26–29, 2026, in Orlando, Florida, USA — the premier international forum for packaging, components, and microelectronic systems science and technology.

At ECTC, SUSS will highlight its process solutions that support advanced packaging and integration challenges. Our technologies for wafer bonding, lithography, and precision processing enable reliable, scalable manufacturing of next‑generation electronic systems.

Connect with the SUSS team on site to explore how our solutions help address complex packaging requirements and deliver robust process performance across research and production environments.