Advancing Microelectronics with SUSS Technologies at IMAPS Italy 2026

The IMAPS Italy 2026 event brings together experts from microelectronics and advanced packaging to discuss current developments in materials, processes, and system integration.

At this partner event, SUSS technologies will be presented by ElectronMec, showcasing our capabilities in wafer bonding and lithography for advanced packaging applications. Our solutions enable precise alignment, reliable integration, and stable process performance—supporting the transition from development to scalable manufacturing.

Join the discussion to learn how SUSS, together with ElectronMec, supports efficient and high-quality production strategies in modern microelectronics.