Driving Next-Gen HBM with SUSS at I.S.E.S. Taiwan 2026

SUSS will be at I.S.E.S. Taiwan 2026, presenting solutions that enable next-generation high-bandwidth memory (HBM) manufacturing. Our wafer bonding and lithography technologies support precise, reliable processes from low-TTV temporary bonding & debonding to face-to-back W2W hybrid bonding.

At the event, Robert Wanninger will give a presentation: “Paving the Way for Next-Generation HBMs: From Low-TTV Temporary Bonding & Debonding to Face-to-Back W2W Hybrid Bonding”, showcasing how SUSS solutions drive innovation and scalability in advanced packaging.

Meet the SUSS team on site to learn how our process technologies help manufacturers tackle complex HBM challenges efficiently.