SUSS Technologies on Display at NordPAC 2026

NordPAC 2026 in Stockholm, Sweden, is a key regional gathering for the advanced packaging community, bringing together industry leaders, engineers, and researchers to explore the latest technologies and trends in semiconductor packaging and integration.

At this partner event, SUSS technologies will be presented by inseto, highlighting our solutions in wafer bonding, lithography, and precision processing for advanced packaging applications. Our systems are designed to deliver the accuracy, reliability, and scalability required for modern packaging challenges, from prototyping to volume production.

Visit the NordPAC forum to connect with the inseto team, and discover how the SUSS process technologies help manufacturers navigate complexity and drive innovation in advanced semiconductor packaging.