Hybrid bonding solutions

XBC300 Gen2 D2W/W2W Hybrid Bonding Platform

The XBC300 Gen2 D2W/W2W is the world's first hybrid bonding platform that integrates wafer-to-wafer (W2W), collective die-to-wafer (D2W), and sequential D2W bonding in a cluster system. Developed in collaboration with our partner SET Corporation SA, it supports substrates ranging from 200 mm to 300 mm and allows for handling dies on tape frame carriers.

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Your versatile platform for hybrid wafer bonding

Capable of all hybrid bonding processes, the XBC300 Gen2 D2W/W2W enables advanced 3D stacking applications – from system-on-chip (SoC) to stacked ICs (SICs). Designed for R&D and pilot lines, it provides a reliable, scalable path to high-volume manufacturing through modular process technology.

Integrated In-Situ Metrology

Equipped with a high-precision, throughput-optimized metrology station, the XBC300 Gen2 D2W/W2W enables in-line verification of alignment accuracy throughout all process steps. The metrology module supports full-field IR overlay measurement and IR void inspection, with a detection resolution >500 µm void sizes.

Carrier Versatility: Silicon & Glass

Building on the industry-renowned XBC300 Gen2 platform the XBC300 Gen2 D2W/W2W extends its capabilities to process dies on tape frame carriers, ensuring reliable performance for future-ready designs.

State-of-the-Art Performance

The XBC300 Gen2 D2W/W2W features the integrated NEO HB die bonder from SET Corporation SA, delivering ±100 nm alignment accuracy for advanced die-to-wafer bonding with bond forces of up to 300 N.

Compact Footprint

The XBC300 Gen2 D2W/W2W combines W2W and D2W bonding capabilities in a single integrated platform – offering a significantly smaller cleanroom footprint compared to traditional stand-alone cluster setups. Its streamlined process architecture substantially reduces overall investment and total cost of ownership.

Accurate, adjustable, future-proof.

Key Features of XBC300 Gen2 W2W/D2W Hybrid Bonding System

Equipped with innovative SUSS technology, the XC300 Gen 2 W2W/D2W sets new standards for advanced semiconductor manufacturing and provides a fully integrated solution for hybrid bonding.

Alignment Accuracy of < 100 nm for W2W bonding

The XBA Bond Aligner achieves consistent sub-micron alignment accuracy for both transparent and opaque wafers using SUSS’s Inter-Substrate Alignment (ISA) technology, integrated optical reference, and global calibration. It delivers < 100 nm alignment precision for W2W, meeting even future pitch scaling requirements

Die-Spacing Down to 40 µm

XBC300 Gen2 D2W/W2W delivers industry-leading cleanliness and alignment accuracy for high-yield, high-throughput die-to-wafer transfer. Its innovative design enables ultra-low inter-die spacing down to 40 µm, ensuring high die density on target substrates.

Superior Cleanliness

Aqueous cleaner modules for full wafers and tape-frames feature various dispense options, including megasonics, optional backside rinse and N₂-assisted spin-drying. Standard configurations support diluted chemistries such as < 2% NH₄OH or citric acid, with SC1-based organic removal.