Maximum reliability in every bond

Permanent Wafer Bonding Systems

SUSS permanent bonding systems deliver the precision and reliability needed for today´s advanced packaging. Sophisticated technologies for superior bond alignment and scalable platforms for diverse wafers and materials ensure device quality, maximum yield, and future-ready bonding from R&D to high-volume production.

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Reliable bonding across applications

Durable, void-free wafer bonds with precise control: SUSS systems deliver high post-bond accuracy, quality & high yield for every process.

Top products

Discover our top products

XBC300 Gen2 D2W/W2W

Hybrid bonding platform that integrates W2W, collective D2W, and sequential D2W bonding in a single system.

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Automated

XBC300 Gen2 D2W

XBC300 Gen2 D2W is your fully automated solution for sequential die-to-wafer hybrid bonding on 200mm and 300mm substrates.

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XBC300 Gen2 D2W hybrid bonding platform by SUSS

Automated

XBS300 W2W

XBS300 W2W hybrid bonding platform is designed for automated hybrid fusion bonding of aligned 200mm and 300mm wafers.

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Automated

XBS200

Universal, automated wafer bonding platform for high-volume production, allowing for aligned wafer bonding of wafer sizes up to 200 mm.

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Automated

XB8

Universal, semi-automated high-force wafer bonder, supporting substrates with a wafer size of up to 200 mm.

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Semi-automated

SB8 Gen2

Universal, semi-automated wafer bonding system, handling wafers up to 200 mm.

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Semi-automated

Key Benefits

Tight process control

Industry-leading technologies deliver submicron overlay precision and void-free results, ensuring high quality, durable packaging.

Unmatched flexibility

Modular configurations support a broad range of wafers, stack-ups and advanced packaging material ideal for high-density hybrid, MEMS, LED and emerging device architectures.

Proven volume manufacturing

Engineered for the rigors of high-throughput, high-stakes semiconductor production, SUSS permanent bonding solutions ensure reliability, reproducibility, and device integrity at every scale.

Smart metrology for optimal quality

Integrated metrology in SUSS permanent bonding systems ensures sub-micron layer alignment and long-term stability. By capturing topology, verifying overlay, and monitoring process shifts, the system detects deviations early. This safeguards bonding quality across hybrid and direct processes.