Automated Coating Solutions

ACS200Gen3 TE 200 mm Coater & Developer

The ACS200 Gen3 TE for 200 mm wafers is the further advanced version of the ACS200 Gen3 with higher throughput, future-ready options and operation comfort for advanced packaging applications of tomorrow.

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Higher throughput, increased user comfort

Advanced automation, unmatched configuration flexibility: The ACS200 Gen 3 TE combines innovative features and stable processing making it the platform of choice for transferring R&D results into robust high volume manufacturing.

Extended Flexibility

Experience manufacturing flexibility due to configurable 3M, 5M, and 6M frames and 100 to 200 mm wafer processing with fast tooling changeover. The scalable, field-upgradable cluster architecture, 2 or 4 I/O stations or a continuous run load port plus market-leading scheduler properties deliver maximum productivity and stable results.

Increased Productivity

The ACS200 Gen3 TE boosts throughput by more than 30% compared to the ACS200 Gen3. Up to Six spinner modules and the introduction of In-Motion Centering (IMOC) streamline the handling process, thus eliminating a separate alignment step for faster, more efficient processing.

Comfortable Operation

Designed with the operator in mind: the ACS200 Gen3 TE includes two standard monitors and easily accessible media cabinets for better usability and convenience. Additionally, lifted EMO (Emergency-off) buttons prevent accidental activation, while a modern white color scheme improves the work environment.

Improved Media Flow Accuracy

New features for process stability and flexibility: A precise flow controller ensures more accurate media dispensing, while a new combined developer module handles both aqueous and solvent processes thus eliminating the need for separate modules.

Effortless Handling of Challenging Wafers

Warped, ultra-thin or stacked wafers – the special designed tooling with sophisticated chuck and bowl design plus end effectors ensures secure handling of all kinds of substrates while meeting all standards for protection against electrostatic discharge (ESD).

Key Features of ACS200 Gen3 TE 200mm Coater & Developer

Benchmark for ultimate performance

State-of-the-art technology plus easy handling: the ACS200 Gen3 TE allows for accurate, flexible and robust operations and delivers ultimate throughput.

High-Precision Thin Resist Processing

The perfect fit for Redistribution Layer (RDL) and Microelectromechanical System (MEMS) application: handle thin resist applications supporting viscosities from very low (<100cp) to high (<5,000cp) and achieve film thicknesses between thin (<100nm) and thick layer (<10um).

Thick Resist Processing for Advanced Packaging

Engineered for Advanced Packaging applications, you can achieve film thicknesses including passivation from <5µm to <250µm. The ACS200 Gen3 can process any resist type with a viscosity range from very low (<100cp) to very high (<20,000cp)

Versatile Develop Processes

Get maximum flexibility to develop thin and thick resists or polyimide with a variety of media, from TMAH to solvent-based solutions. With different nozzle types and N₂ purge drying options, you achieve precise control and flawless results every time.

Downloads

Looking for more details? Please click below to download the technical datasheet and our product presentation with in-depth product information.

Product Overview Brochure EN

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