Automated Coating Solutions

ACS300 Gen2 Automated Coater & Developer

The ACS300 Gen2 is the fully automated coater/developer platform for 200 and 300 mm wafers. The high-end system supports the entire workflow from pilot lines to high-volume manufacturing, making it the best-in-class choice for sophisticated resist processing, 3D-Integration and wafer level packaging.

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The premium all-in-one solution

All coating processes in one platform: the ACS300 Gen2 combines dual wafer size processing and supreme technology for packaging of all substrates with best-in-class uniformity and quality. The modular design and multiple, scalable configuration options make it the ideal investment for both current and future device generations for any production scale.

Redefined Flexibility & Productivity

Individually configurable with modular I/O and frame concepts, the platform enables simultaneous 200 and 300 mm wafer processing without mechanical changeover. The scalable, field-upgradable cluster architecture, state-of-the-art extension modules and the market's best scheduler enable unmatched throughput.

Unique GYRSET® Coater Technology

SUSS’s proprietary GYRSET^®technology creates a turbulence-free, solvent-rich atmosphere during coating, ensuring stable results independent of ambient conditions. It reduces misproduction, supports sustainability, and is especially effective for thick resist processing.

State-of-the-Art Hotplate Concept

The innovative heating design reduces crystallization and thus, the cleaning frequency while the new suspension in stack makes for easy leveling. A highly optimized airflow prevents condensation, thus ensuring optimum baking processes.

Integrated Metrology for High-end Wafers

Warped, ultra-thin or stacked wafers – the ACS300 Gen2 platform handles all with ease. The TM300 metrology module provides automated interferometric measurements and real-time process control for superior coating precision, while specially designed tooling with sophisticated chuck and bowl design ensures secure substrate handling and full ESD protection.

Maximum Precision: SUSS Dispense System

The SUSS Dispense System with its integrated resist supply provides precise, repeatable dosing of low and high-viscosity materials. A self-calibration feature and closed-loop control ensure high accuracy, while a bubble sensor guarantees flawless application.

Key features of ACS300 Gen2 Automated Coater & Developer

Your coating platform for tomorrow’s packaging

One cluster for coating, baking, and developing across a wide range of photoresist thicknesses and dielectric materials – all without mechanical changeover. The ACS300 Gen2 delivers unmatched versatility, precision and throughput as the cost-effective processing solution for the advanced packaging market.

Unmatched Range in Resist Processing

Process any resist type with a viscosity range from very low (<100cp) to very high (<20,000cp) and achieve film thicknesses from incredibly thin (<100nm) to very thick layers (<250µm) – all with a single system.

Pioneering Dry-Resist Processing

As the #1 tool manufacturer for dry-resist film development, we offer a state-of-the-art solution with relevant features for high-volume manufacturing (HVM). The ACS300 Gen2 delivers high throughput and uptime, ensuring maximum productivity.

Inline Metrology for Film Control

Superior coating precision and consistency: The integrated TM300 metrology module for automated interferometric measurements and real-time process control provides automated film thickness adjustment measurement from 1-100 micrometers with adaption for other film thickness on request.