MA300 Gen3 Mask Aligner

Proximity exposure combines speed, precision, and ​excellent​​​ cost efficiency. It enables high-quality microstructures at a fraction of the cost of projection systems making it the method of choice for advanced packaging and high-volume manufacturing. 

Built on decades of SUSS expertise, proximity lithography transfers structures with precision while avoiding depth-of-focus limitations. This proven exposure method delivers robust and repeatable performance, enabling stable results across demanding processes from thick-resist MEMS to fine-pitch packaging. 

For demanding overlay requirements, the MA300 Gen3 features DirectAlign^® with industry-standard PatMax. Using live images instead of stored patterns, it achieves top-side alignment accuracies down to 0.5 µm ensuring exceptional process stability and repeatability ideal for high-volume applications. 

An optional SUSS filter unit creates a sealed mini-environment inside the aligner, independent of cleanroom fluctuations. With fewer particles and greater air stability, process consistency improves, defectivity drops, and product quality rises—helping fabs reduce rework and overall manufacturing costs.