Stamp fabrication tool

UV-SFT Series Stamp Fabrication Tool

The UV-SFT Series is SUSS's compact table-top tool for fast, precise fabrication of high-quality working stamps for micro- and nanoimprint lithography. Designed to complement MA/BA Gen4 Series 8″ mask aligners, it delivers consistent results for R&D and high-volume manufacturing across LEDs, MEMS/NEMS, micro-optics, AR, and optoelectronic sensors.

Talk to an expert

Empowering research with precision and versatility

The MJB4 combines proven lithography performance with process versatility for research and low-volume production. Supporting fragile materials and UV-NIL, the system´s sub-micron resolution, and quick substrate changeovers make it a cost-efficient solution. allowing exploration of new applications with reliable results.

Precision for Every Process

Precise alignment and high-quality results for a wide range of applications, flexible exposure modes, including soft, hard, and vacuum, combined with high-resolution optics and SUSS microscopes deliver resolutions ranging from 2 µm down to less than 0.5 µm.

Cost-Efficient by Design

Purpose-built for universities and small-scale production, the MJB4 combines affordability with stabel performance. Its compact design, fast setup, configuration upgrades and reliable operation ensure a quick return on investment making the system a cost-efficient and flexible choice for agile R&D labs.

Versatile Pioneer in Lithography

As one of the first mask aligners, the MJB4 platform set industry standards in research and low-volume manufacturing. Equipped with state-of-the-art technology and multiple configuration modes, the system remains the reference tool for small substrates and pieces worldwide.

Operator Ease & Comfort

With an intuitive interface and straightforward controls, the MJB4 is designed for exceptional user friendliness. Automated Wedge Error Compensation (WEC) and integrated simulation software for lithographic processes simplify operation, minimize setup time, and guarantee optimal processing for best results.

Key Features of the UV-SFT Series Stamp Fabrication Tool

Sophisticated stamps for any scale

Combining precise engineering with flexible processing for superior stamp fabrication, the UV-SFT series provides quality, efficiency, and process reliability across micro- and nanoimprint applications, supporting seamless integration from R&D to HVM.

Excellent Light Uniformity

With micro-lens plates, MO Exposure Optics^® provides light uniformity over the full exposure field and a larger process window, leading to higher yields. The telecentric illumination decouples the exposure light from the lamp source, saving on setup and maintenance time while ensuring consistent results throughout the lamp's lifespan.

Precise Alignment, Broad Flexibility

The MJB4 is equipped with a high-precision alignment stage, offering top-side or IR alignment and a choice of Singlefield or Splitfield microscopes for clear pattern recognition and precise results. With optional upgrades for nonstandard substrates or UV-nanoimprint lithography, the system is ideal for MEMS, optoelectronics, hybrids, and fragile III-V materials.

Adaptable Tooling

The MJB4 grows with your research needs: with a large tooling library that can handle pieces from 5x5 mm up to 100 mm wafers in various shapes and thicknesses up to 4 mm, the MJB4 provides maximum flexibility. Specialized tooling is also available for handling odd-shaped substrates and other non-standard pieces.

Downloads

Looking for more details? Please click below to download the technical datasheet and our product presentation with in-depth product information.

Product Overview Brochure EN

PDF

Related products

Discover our portfolio of imaging solutions

MA12 Gen3

The semi-automated system for mask alignment of wafers up to 300 mm for advanced packaging, MEMS, and imprint lithography applications.

Learn More

Semi-automated

MA/BA Gen4 Series

The new platform system of SUSS’s semi-automated mask and bond aligner: the two system types MA/BA Gen4 and MA/BA Gen4 Pro differ in configuration and are engineered for standard processes or advanced and high-end processes.

Learn More