Permanent bonding solutions

XBS200 Wafer Bonder

Maximum flexibility and consistent process results: the universal XBS200 wafer bonder for wafer sizes up to 200 mm is specifically designed for high-volume production of MEMS, LED and 3D advanced packaging.

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Your Benefits

The XBS200 delivers high process flexibility across all permanent bonding tasks. Its novel aligned wafer transfer method reduces the complexity of traditional systems while ensuring consistent results and high system availability.

Modular Architecture

The XBS200 easily adapts to your needs. With its modular architecture, the system scales seamlessly to support evolving production demands across all permanent bonding applications.

World`s First Fixture-Less Automated Platform

The XBS200 eliminates the need for mechanical fixtures, enabling flexible wafer handling. This not only increases yield, and cost efficiency but also allows for comprehensive digital monitoring of handling parameters such as spacing conditions and vacuum.

Unique Wafer Joining Technique

The XBA Bond Aligner's Inter-Substrate Alignment (ISA) technology delivers submicron accuracy with automated setup and patented technology for W2W bonding. Integrated calibration and overlay verification ensure controlled, reproducible results even for demanding applications.

Designed for reliable results

Key Features of XBS200 Wafer Bonder

Sophisticated technology, unmatched versatility: The XBS200 is the ideal wafer bonder for high-quality, high-volume production.

Bond Strength 5 kN - 100 kN

The XBS200 allows for bond forces between 5 kN-100 kN, enabling optimal processing across a broad range of bonding applications and wafer types. Adjustable tool force zones ensure uniform pressure distribution, minimizing mechanical stress and ensuring consistently high bond quality.

Precise Temperature Control

Equipped with a dual-zone ceramic heater, XBS200 offers a temperature range from 30 °C to 500 °C, controlled independently via closed-loop systems. Ramping speeds of up to 30 K/min and uniformity within ±1.5 % ensure fast, consistent processing.

Alignment Accuracy < 100 nm

Patented XBA technology with Inter Substrate Alignment (ISA) delivers accuracy down to 100 nm, ensuring high quality and yield in demanding high-precision applications. Self-optimizing alignment combined with unique deflection bonding enables efficient and consistent production.