W2W Hybrid Bonding

XBS300 W2W Hybrid Bonding Platform

XBS300 W2W is designed for automated hybrid bonding and fusion bonding of aligned 200mm and 300mm wafers. The platform supports both wafer-to-wafer (W2W) and collective die-to-wafer (D2W) bonding, offering maximum flexibility for advanced integration processes.

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All options in one system

Thanks to its modular design, the XBS300 W2W hybrid bonding platform for 3D stacked memory or 3D SOC is ideally suited for both R&D as well as high-volume production.

Individual Configuration

The XBS300 W2W platform comes standard with a high-performance metrology module and surface activation, enabling efficient single-wafer processing. Its modular design allows additional features to be integrated with ease, making it an ideal solution for high-volume production, too.

Proprietary Technology for Highest Precision

The patented XBA technology with Inter Substrate Alignment (ISA) provides high-accuracy alignment for most demanding pitch applications with < 100 nm overlay. The built-in optical fixed reference, global calibration and overlay verification ensure optimum repeatability and guarantees steady production quality.

Integrated In situ Metrology

A key advantage of the integrated in-situ metrology is the closed-loop feedback of offset parameters directly to the bond aligner, enabling consistent overlay performance with every run. The system supports flexible configurations, including IR void inspection as well as high-accuracy IR overlay measurement. For maximum scalability, up to six metrology modules can be integrated into a single cluster.

A platform that adapts to your demand

Key Features of XBS300 W2W Hybrid Bonding Platform

The modular design of the XBS300 W2W allows for flexible configuration. Hardware upgrades – such as a temperature control unit, in-situ deflection measurement, or x/y/θ closed-loop stage control – can be easily installed, enabling alignment performance down to 100 nm.

Outstanding Alignment Performance

Thanks to its Temperature Control Unit (TCU), XBS300 W2W delivers an outstanding alignment performance, independent of cleanroom conditions. The system maintains exceptional thermal stability of ±25 mK over 12 hours, ensuring consistently precise bonding results in any production environment.

Precise Alignment Control in Three Dimensions

Real-time, closed-loop control of X, Y, and θ stage movements automatically corrects alignment and rotation errors—ensuring precise wafer positioning and consistently high bonding alignment.

SUSS Unique In situ Wafer Deflection Monitoring

The proprietary in-situ deflection monitoring of the XBS300 W2W platform compensates for incoming wafer variations, run-out, and substrate properties – delivering significantly higher process precision and consistently reliable bonding results.