Debonding solutions

DB12T Debonder

The DB12T debonder is a state-of-the-art solution for mechanical peel-off debonding at room temperature. The system separates support carriers from tape-mounted wafers as thin as 50 µm or even below. Available tooling options support wafer sizes from 4" to 12", as well as various carrier materials such as glass or silicon.

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Your Benefits

Thanks to its advanced process control features, the DB12T debonder is perfectly suited for a wide range of thin wafer applications – including power devices, 2.5D interposers, 3D integrated devices, 3D wafer-level packaged MEMS, and fan-out wafer-level packages.

Perfect Compatibility

The DB12T is compatible with a broad range of adhesives and release layers specifically designed for mechanical debonding.

Advanced Process Control

Debonding force, debonding speed, and the insertion height of the initiator blade: all key debonding parameters can be controlled electronically to ensure optimal performance across different wafer sizes and topographies.

Shortest Possible Debond Front

The DB12T uses a dedicated roller to control the debond wave front with high precision, enabling the shortest possible debond front and minimizing stress on the device wafer to ensure maximum yield and device quality. Parameters can be programmed by zone for optimized force distribution across the process.

Programmable precision

Key Features of DB12T Debonder

DB12T gives you full control over all relevant debonding parameters – thus minimizing the debond front and maximizing process reliability.

Programmable Debond Initiation

The DB12T features adjustable and programmable debond initiation so, for example, the insertion height of the initiator blade can be defined with micrometer precision.

Electronic Process Monitoring

All debonding parameters are continuously monitored throughout the process. Interlock settings ensure the process is halted if the debond front fails to propagate.

Additional Tooling Options

The DB12T debonder allows for easy scalability through a range of additional tooling options. These support wafer sizes from 4" to 12", as well as various carrier materials including glass and silicon.