ACS200 Gen3 Coater & Developer

Combining Expertise with Innovation

The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.

Highlights

Unmatched configuration flexibility

Serving HVM and R&D in Advanced Packaging, MEMS and LED markets

Highest process module count of any 200 mm coater / developer on the market

SUSS MicroTec Developer ACS200 Gen3

The versatile base frame provides multiple configuration possibilities, e.g. up to 4 wet process modules (either coater and /or developer) with up to 19 plates or 2 wet process modules and 2 spray coater modules with up to 13 plates.

With the possibility of stacking up to 3 plates over each wet process module and up to 7 plates in the 5th module, the ACS200 Gen3 allows the maximum module count in its class.

Different I/O systems match with any need. The 2x I/O serves R&D requirements, whereas the new designed auto load cassette station enables a continuous operation without stopping the system for cassette exchange.

The novel coater bowl offers state of the art open bowl coating and the patented GYRSET® closed cover coating technology. The bowl design offers the possibility to use disposable process bowls for operation without compromising in flow dynamics or exhaust flows. It simplifies operation with inconvenient or unusual materials due to easy cleaning of the bowl and reduced maintenance time. The possibility to separate the solvent and resist lines on 2 different dispense arms per coater module, the ACS200 Gen3 follows consequently the path on providing excellent yield.

For developing applications, either an aqueous or solvent developer module can be configured. A high variety of different nozzle types are available to match with any process requirement.

The direct connection to a SUSS exposure system increases yield as no operator interaction is necessary for a complete lithography process flow.

Optional filter fan units and temperature / humidity control of the tool results in process stability, reproducibility and finally in a high yield.

Details: Coating

Spin coating is the process of evenly coating a spinning substrate with a solution. The solution, for instance a photosensitive resist, is dispensed at the center of the wafer. Subsequent acceleration as well as the rotation speed and the time allotted to the individual steps ensure that a homogeneous layer thickness remains after excess resist is spun off. Alongside the process parameters, the physical properties of the solution or photoresist determine the thickness of the applied film.

SUSS MicroTec’s patented GYRSET technology provides cutting-edge advantages. The GYRSET principle entails synchronous rotation of the process chamber during coating, in this way effectively reducing air turbulence over the rotating substrate. The atmosphere within the closed chamber becomes more quickly saturated with solvents, so that the resist dries more slowly and is thus distributed more evenly over the substrate. This results in significant savings in terms of required material.

Spin coating is limited in use to structures without high topography.

Features and Benefits

  • Spin coating: a simple and widely used technique
  • Patented GYRSET technique reduces the material required and cuts costs

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

Spray coating involves spray application of the solution to the wafer through a nozzle. The path traveled by the nozzle over the wafer is optimized to ensure that the coating is applied evenly to the substrate. The solutions used in spray coating usually feature a very low viscosity, which guarantees that fine droplets form.

Spray coating ensures a uniform layer even with high topography substrates, making it the preferred technique for structures of this kind. Even square substrates can be easily coated using the spray technique.

Features and Benefits

  • Uniform coating even of highly structured surfaces

Available for:

Automated Coater and Developer

Semi-Automated Coater

Puddle developing involves dispensing a defined quantity of developer to the exposed substrate, gently spinning it to spread the developer. Due to the surface tension of the developing agent, a convex puddle is formed on the wafer. Once developing time is completed, the wafer is rotated quickly to spin off the developer agent. The wafer is subsequently rinsed with deionized water and dried, once again at a high rotation speed. The main advantage of the technique is that only very little developing agent is required while maintaining excellent process results.

Puddle developing is no longer feasible when the developing agent becomes saturated, for example when a large quantity of photoresist needs to be removed or a high structural topography prevents exchange of the developer. In such cases, a multi-stage puddle developing process or spray developing is used.

Features and Benefits

  • Minimal chemical consumption

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

Spray developing involves low-speed rotation of the substrate as it is developed. The exposed areas are continuously nozzle-sprayed with fresh developing agent to prevent the developer from becoming saturated. This technique offers advantages over puddle developing in processes involving thick photoresists and large surfaces to be developed. At the end of the process, the substrate is rinsed with deionized water and then spun dried.

Features and Benefits

  • Uniform developing of the entire wafer surface even with thick resist layers

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

SUSS MicroTec’s proprietary GYRSET® technology helps to significantly improve spin coating process results by improving the conditions during coating. With the help of a rotating cover a turbulence-free atmosphere, highly saturated with solvents, can be created. This not only makes the outcome more independent from the ambient temperature and humidity. It also substantially reduces the amount of material required to coat a wafer therefore being beneficial for environmental sustainability.

The GYRSET® technology is highly suitable for processing thick resists.

Highlights

  • Prevents back-side contamination
  • Little surface roughness
  • Improves surface planarity
  • Reduces chemical consumption 

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

SUSS MicroTec's proprietary AltaSpray® coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray® technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging.

SUSS AltaSpray® topography coating modules are available for the ACS200 Gen3 and ACS300 Gen2 platforms. The AltaSpray module allows processing of wafers with diameters of 200mm and 300mm as well as squares up to 8" edge length. All AltaSpray coater modules are can be equipped with up to two separate spray dispense systems. The sophisticated resist supply system offers unmatched process stability and reproducibility. All spray and cleaning parameters can be programmed in the recipe.

Highlights

  • Enabling technology for patterning across severe topography
  • Conformal coating with top edge coverage while avoiding resists accumulation in trenches
  • Proprietary spray design for optimal process stability and reproducibility
  • Up to two separate spray dispense systems
  • All process parameters are programmable in the recipe

Available for:

Automated Coater and Developer

Optimal and complete use of chemicals.

Available for:

Automated Coater and Developer

Intelligent scheduling algorithms: Improve yield by avoiding bottlenecks.

Available for:

Automated Coater and Developer

Bent and warped wafers are carefully pulled flat before alignment and exposure. Due to the variety of the parameters that affect it, an optimal tooling implementation requires adaptation for the specific substrate.

Available for:

Automated Coater and Developer

A special carrier system protects the wafer, especially suitable for the protection of double-sided structures as for MEMS applications.

Available for:

Automated Coater and Developer

Downloads
ACS200 Gen3 Datasheet 241kb
SUSS Product Porfolio 1371kb
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