ACS200 Gen3 Coater & Developer

Combining Expertise with Innovation

The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.

Highlights

  • Unmatched configuration flexibility
  • Serving HVM and R&D in Advanced Packaging, MEMS and LED markets
  • Highest process module count of any 200 mm coater / developer on the market
ACS200 Gen3 Coater & Developer

The versatile base frame provides multiple configuration possibilities, e.g. up to 4 wet process modules (either coater and /or developer) with up to 19 plates or 2 wet process modules and 2 spray coater modules with up to 13 plates.

With the possibility of stacking up to 3 plates over each wet process module and up to 7 plates in the 5th module, the ACS200 Gen3 allows the maximum module count in its class.

Different I/O systems match with any need. The 2x I/O serves R&D requirements, whereas the new designed auto load cassette station enables a continuous operation without stopping the system for cassette exchange.

The novel coater bowl offers state of the art open bowl coating and the patented GYRSET® closed cover coating technology. The bowl design offers the possibility to use disposable process bowls for operation without compromising in flow dynamics or exhaust flows. It simplifies operation with inconvenient or unusual materials due to easy cleaning of the bowl and reduced maintenance time. The possibility to separate the solvent and resist lines on 2 different dispense arms per coater module, the ACS200 Gen3 follows consequently the path on providing excellent yield.

For developing applications, either an aqueous or solvent developer module can be configured. A high variety of different nozzle types are available to match with any process requirement.

The direct connection to a SUSS exposure system increases yield as no operator interaction is necessary for a complete lithography process flow.

Optional filter fan units and temperature / humidity control of the tool results in process stability, reproducibility and finally in a high yield.

Details : Coating

  • Spin Coating
  • Spray Coating

Details : Developing

  • Puddle Developing
  • Spray Developing

Options

  • GYRSET®
  • Inverted Bottle
  • Scheduler-Software
  • Handling of Warped Wafers
  • AltaSpray®
  • Baking
  • Vapor-Priming
  • Edge-Handling