Automated Coating Solutions

ACS200 Gen3 200mm Automated Coater & Developer

Versatile and reliable: the ACS200 Gen3 is the perfect coater and developer solution for both R&D and high-volume manufacturing of 100 mm to 200 mm wafers. Thanks to its modular architecture, the platform easily adapts to your specific needs, ensuring seamless scalability and stable operations.

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The flexible solution for every scale

With robust automation and flexible modules, the ACS200 Gen3 ensures reliable processing for both research and high-volume production. High repeatability guarantees consistent results and yield, while its quality design minimizes downtime and adapts to your specific needs.

Redefined Flexibility & Productivity

Experience high flexibility due to configurable 3M, 5M, and 6M frames and 100 to 200 mm wafer processing with fast tooling changeover. The scalable, field-upgradable cluster architecture and market-leading scheduler properties deliver maximum productivity.

Unique GYRSET® Coater Technology

SUSS’s proprietary GYRSET^®technology creates a turbulence-free, solvent-rich atmosphere during coating, ensuring stable results independent of ambient conditions. It reduces misproduction, supports sustainability, and is especially effective for thick resist processing.

Scalable Process Module Count

With 2 or 4 I/O stations as standard or continuous run load port, the ACS200 Gen3 adapts precisely to individual production volume and process requirements. This ensures maximum flexibility and throughput in any manufacturing scale.

Effortless Handling of Challenging Wafers

Warped, ultra-thin or stacked wafers – the special designed tooling with sophisticated chuck and bowl design plus end effectors ensures secure handling of all kinds of substrates while meeting all standards for protection against electrostatic discharge (ESD).

Maximum Precision: SUSS Dispense System

The SUSS Dispense System with its integrated resist supply provides precise, repeatable dosing of low and high-viscosity materials. A self-calibration feature and closed-loop control ensure high accuracy, while a bubble sensor guarantees flawless application.

Key Features of ACS200 Gen3

The coater for every need

From Redistribution Layer (RDL) to Microelectromechanical System (MEMS) and beyond, the ACS200 Gen3 handles diverse requirements with equally high quality. Whether thin or thick resists or different developer media – expect perfect results every time.

High-Precision Thin Resist Processing

The perfect fit for Redistribution Layer (RDL) and Microelectromechanical System (MEMS) application: handle thin resist applications supporting viscosities from very low (<100cp) to high (<5,000cp) and achieve film thicknesses between thin (<100nm) and thick layer (<10um).

Thick Resist Processing for Advanced Packaging

Engineered for Advanced Packaging applications, you can achieve film thicknesses including passivation from <5µm to <250µm. The ACS200 Gen3 can process any resist type with a viscosity range from very low (<100cp) to very high (<20,000cp).

Versatile Develop Processes

Get maximum flexibility to develop thin and thick resists or polyimide with a variety of media, from TMAH to solvent-based solutions. With different nozzle types and N₂ purge drying options, you achieve precise control and flawless results every time.