Uniform UV exposure for consistent results

SUSS Projection Scanner

SUSS Projection Scanner deliver a unique projection lithography solution for advanced wafer processing. Combining full-field UV exposure with single continuous scanning, they ensure uniform results without stitching or over-exposure defects. Designed for high throughput and non-contact operation, our systems enable cost-efficient, high-resolution lithography across diverse applications in semiconductors, MEMS, and advanced packaging.

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Sophisticated projection lithography

Full-field UV projection with single-scan mode ensures defect-free uniformity, high throughput, and a cost-efficient alternative to steppers.

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DSC300 Gen3

High-throughput projection lithography scanner for 200mm and 300mm wafers in advanced packaging.

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SUSS Projection Scanner

Key Benefits

Edge-to-edge projection

Unlike steppers, SUSS projection scanners expose the entire wafer in a single pass. This eliminates stitching errors, prevents over-exposure defects, and delivers uniform resolution across every substrate – ensuring stable, repeatable results in advanced semiconductor and packaging lithography.

Seamless scanning

With single continuous scanning, wafers are exposed seamlessly in one step. This boosts throughput and secures defect-free uniformity – a decisive advantage for high-volume manufacturing where reliability, speed, and yield are essential.

Cost-optimized imaging

Combining projection optics with full-field exposure, SUSS Projection Scanners provide a high-performance, cost-efficient solution to steppers. Our systems reduce complexity and operating costs while ensuring the precision needed for MEMS, semiconductors, and advanced packaging applications.

Integrated Metrology for accurate high throughput

Integrated metrology secures prealignment precision even at the highest wafer-per-hour rates. Built on robust UMS architecture, our modules optimize throughput, minimize downtime, and ensure stable scanner performance – maintaining accuracy and reliability across diverse substrates and process conditions