Temporary Bonding Solution

XBS300 temporary bonding platform

SUSS‘s XBS300 platform for temporary bonding represents the next generation of high-volume manufacturing temporary bonder solutions. The 200/300 mm wafer bonding platform can be configured for a low cost of ownership and maximum process flexibility.

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All options in one system

Thanks to its flexible configuration the XBS300 is able to process all commercially available temporary bonding adhesives.

Individual configuration

The XBS300 platform comes standard with a high-performance metrology module, enabling efficient single-wafer processing. Its modular design allows additional features to be integrated with ease, making it an ideal solution for high-volume production, too.

Proprietary technology for highest precision

The patented XBA technology with Inter Substrate Alignment (ISA) provides high-accuracy alignment for most demanding pitch applications with < 100 nm overlay. The built-in optical fixed reference, global calibration and overlay verification ensure optimum repeatability and guarantees steady production quality.

Compatible with silicon and glass carriers

The XBS300 Temporary Bonder offers full compatibility with silicon and glass wafers, enabling flexible material handling without extensive requalification. This streamlines operations, reduces downtime, and supports efficient integration into high-volume manufacturing.

A platform that adapts to your demand

Key Features of XBS300 temporary bonding platform

The modular design of the XBS300 allows for flexible configuration.

Supporting a wide range of temporary bonding materials

The XBS300 temporary bonder is designed to support a wide range of temporary bonding materials, providing maximum flexibility for thin-wafer handling and advanced packaging processes. The platform supports stable adhesion, reliable debonding performance and seamless integration into semiconductor manufacturing workflows.

Best-in-class TTV

The XBS300 delivers excellent Total Thickness Variation (TTV) performance thanks to its highly precise process control and optimized bonding mechanics. This supports superior yield, enhanced downstream process stability, and reliable device performance.

Built-in metrology

The XBS300’s integrated metrology module provides real-time measurement and alignment verification directly within the bond process. This embedded capability enhances process stability, reduces dependency on external inspection steps, and ensures consistently high bond quality in demanding advanced packaging environments.