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NEW WAFER BONDER
XBS200
新產品
Coater & Developer
ACS300 Gen3
新產品


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News
Corporate News
03. 27. 2019 Publication of the Final Figures for the Fiscal Year 2018
Corporate News
12. 03. 2018

SUSS Partner News Release: Imec reports for the first time direct growth of 2D materials on 300mm wafers

Corporate News
11. 07. 2018 Publication of the Q3 Figures for 2018
處理技術

對於一個具成本效益的多功能高效微晶片製程，於生產計劃時，創新的處理技術相當重要。透過謹慎選擇適宜的方法，可明顯提升生產流程的效率、提高產量，並縮短總生產時間。SUSS MicroTec 的設備在流程的靈活度上相當出色。它們支持多種流程，可以很容易地進行改裝。

設備翻新
Timeless Quality – Trusted Engineering
集团信息

With more than 60 years of engineering experience SUSS MicroTec is a leading supplier of process equipment for microstructuring in the semiconductor industry and related markets. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.

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