SUSS MIcroTec News

新聞
Corporate News
10. 05. 2021 SÜSS MicroTec continues to grow and records record order entry in the third quarter 2021
Corporate News
09. 01. 2021

Partnership between SUSS MicroTec and SET to develop a combined equipment solution for 3D chip integration

Corporate News
08. 05. 2021 SUSS MicroTec publishes half-year report 2021: Successful first half-year and confirmation of the outlook for the fiscal year 2021
產品與解決方案
Products
SUSS MicroTec SE and SET Corporation SA announce a partnership in sequential die-to-wafer (D2W) hybrid bonding
新產品

Semi-Automated/Automated Metrology System

DSM8/200 Gen2

Accurate Metrology | Optional IR Illumination

新產品
處理技術

對於一個具成本效益的多功能高效微晶片製程，於生產計劃時，創新的處理技術相當重要。透過謹慎選擇適宜的方法，可明顯提升生產流程的效率、提高產量，並縮短總生產時間。SUSS MicroTec 的設備在流程的靈活度上相當出色。它們支持多種流程，可以很容易地進行改裝。

設備翻新
Timeless Quality – Trusted Engineering
集团信息

With more than 60 years of engineering experience SUSS MicroTec is a leading supplier of process equipment for microstructuring in the semiconductor industry and related markets. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.

Customer MagazinE | suss report
Knowledge shared
Technical Publication

Additive Reality: Drop Placement Accuracy

Product Manager at SUSS MicroTec, takes a clever engineering spin on Willliam Tell and the apple and how it relates to inkjet equipment for solder mask coating.

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Interview

Functional Inkjet Printing in PCB Manufacture

Read the Interview Online
Customer Service
Operator Training
活動日曆
All Events