Be part of one of the most influential gatherings in advanced packaging. At IMAPS DPC 2026, you’ll connect with leading experts, explore cutting-edge technologies, and discover practical solutions that take products from concept to production.

This is your opportunity to engage with our SUSS experts driving progress in microelectronics, heterogeneous integration, and medical device packaging. You’ll gain insights into the latest advancements.

Visit us at our booth to meet the team and discuss your specific challenges and goals. We’ll share exclusive updates on our latest innovations and roadmap, and explore how we can accelerate your next program together.

Date: March 2-5, 2026
Location: Pheonix, USA
Web: IMAPS Device Packaging 2026